Active and preferred
RoHS Compliant
Lead-free

CY8C6316BZI-BLF03

Data Sheet
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CY8C6316BZI-BLF03
CY8C6316BZI-BLF03
Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-bit @ 1 msps)
  • BLE Maximum Data Rate
    2 MBit/s
  • BLE Power Output
    4 dBm
  • BLE RX Sensitivity
    -95 dBm
  • BLE Supported Frequency band
    2.40 GHz
  • CAN
    0
  • CapSense
    N
  • Comparators
    2
  • CPU
    ARM Cortex-M4
  • Cryptographics Accelerator
    N/A
  • DAC (#, Max. Resolution @ Sample Rate)
    (1,12-bit @ 200 ksps)
  • DMA Channels
    32
  • Family
    PSOC™ 63
  • Flash
    512 kByte
  • Frequency max
    50 MHz
  • FS-USB
    None
  • GPIOs
    78
  • I/O Pins
    78
  • I/O Pins (Smart)
    16
  • I2S
    1
  • LCD Direct Drive
    Y
  • Lead Ball Finish
    Sn/Ag/Cu
  • Number of ADC Modules
    1
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    1.7 V to 3.6 V
  • Operational Amplifier
    0
  • Peak Reflow Temp
    260 °C
  • Publish in NPSG
    Y
  • Publish in PSG
    Y
  • Quad-SPI
    Y
  • Serial Communication Blocks
    9
  • SRAM
    160 kByte
  • Timer/Counter/PWM Blocks
    32
  • Universal Digital Blocks
    0
Recommended
OPN
CY8C6316BZI-BLF03
Product Status active and preferred
Infineon Package
PG-VFBGA-116
Package Name WFBGA-116 (002-16574)
Packing Size 3640
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-VFBGA-116
Package Name WFBGA-116 (002-16574)
Packing Size 3640
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon’s AIROC™ CY8C6347BZI-BLD53 is a high-performance, ultra-low-power and secured MCU platform. It is based on Infineon’s PSOC™ 63 Bluetooth® LE MCU with AIROC™ Bluetooth® LE platform. This device is a combination of a high-performance microcontroller with low-power flash technology, digital programmable logic, high-performance analog-to-digital conversion and standard communication and timing peripherals.

Features

  • 150-MHz Arm® Cortex®-M4F (CM4) CPU
  • 100-MHz Cortex-M0+ (CM0+) CPU
  • CAPSENSE™

Benefits

  • Support fast time-to-market

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }