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Pick-and-Place PG-DSOF-8-16

This Application Note provides information about pick-and-place capability of PG-DSOF-8-16 pressure sensor package, outline dimensions and printed circuit board (PCB) design. The PG-DSOF (Plastic Green Dual Small Outline Flat) is a leaded surface mount package with a flat lead form, where the leads are bent inside the molding compound (Thermo set). The lead surface finish is Ni/NiP/Pd/Au

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Mar 29, 2017