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Recommendations for Board Assembly of Infineon Wafer Level Ball Grid Array Packages

This document provides information about the board assembly of Level Packages (WLP), Wafer-Level Ball Grid Array (WLB) packages and embedded Wafer-Level Ball Grid Array (eWLB) packages. The package and component types cover a wide range of chip sizes and numbers of terminals. The terminals consist of lead-free solder balls that allow for assembly by Surface Mount Technology (SMT). Ball pitches of 0.4 mm and of 0.5 mm are available. This document does not discuss Ball Grid Array (BGA) packages and wafer-level packages without solder balls. These package families are described in a separate document.

1.06 MB
Jul 27, 2020