Active and preferred
RoHS Compliant

EVAL_XDP700

Evaluation board for XDP700-002
User Manual
board
Multiple OPNs available
ea.

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EVAL_XDP700
EVAL_XDP700
ea.
User Manual

Product details

  • Board Type
    Evaluation Board
  • Configuration
    XDP700-002, IPB017N10N5
  • Description
    This board features the XDP700-002, a wide input voltage range (-6.5 to -80V) hot-swap controller to provide controlled turn-on of the FETs to reduce the inrush current on capacitive load. It allows for testing of controlled turn-on of N-Channel MOSFETs in various footprints with option to add multiple FETs in parallel for higher power levels.
  • Family
    XDP™ digital power controller
  • Input Type
    DC
  • Mounting
    Stand Offs
  • Output Current max
    100 A
  • Output Voltage range
    -9 V to -80 V
  • Pout range
    0 W to 6600 W
  • Qualification
    Industrial
  • Supply Voltage range
    -9 V to -80 V
  • Target Application
    Telecom
Recommended
OPN
EVALXDP700TOBO1
Product Status active and preferred
Infineon Package --
Package Name N/A
Packing Size N/A
Packing Type CONTAINER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package --
Package Name -
Packing Size 0
Packing Type CONTAINER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
This board features the XDP700-002, a wide input voltage range (-6.5 to -80V) hot-swap controller to provide controlled turn-on of the FETs to reduce the inrush current on capacitive load. It allows for testing of controlled turn-on of N-Channel MOSFETs in various footprints with option to add multiple FETs in parallel for higher power levels.

Features

  • Easy input and output connections
  • Provides PMBus™ interface
  • Per pin diagnostics
  • Wide input voltage range
  • On board capacitive load
  • Fault, warning, power good LEDs
  • List of components:
  • 2DIB1410F
  • BSR315P H6327
  • IPB017N10N5LF
  • XDP700-002

Benefits

  • Various MOSFET package selection
  • Easy paralleling of MOSFET
  • Port for XDP designer dongle
  • Easy device address selection
  • 3.3V bias
  • On board I2C pullups

Applications

Bill of Material

Documents

Documents

Design resources

Partner solutions