not for new design
RoHS Compliant

CYW20719

Data Sheet
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CYW20719
CYW20719
Data Sheet

Product details

  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -94 dBm
  • Bluetooth LE RX SENSITIVITY
    -95.5 dBm
  • Bluetooth LE TX POWER
    5.5 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.1
  • CPU Frequency
    96 MHz
  • CPU
    Arm® Cortex®- M4
  • Family
    AIROC™ Bluetooth LE & Bluetooth
  • Flash
    1024 kByte
  • GPIOs
    40
  • Launch Date
    31-03-2020
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    1.76 V to 3.63 V
  • Partner Module
    N
  • Planned to be available until at least
    31-03-2035
  • RAM
    512 kByte
  • ROM
    2048 kByte
  • Software Support
    ModusToolbox™
OPN
CYW20719B2KUMLGT CYW20719B2KUMLG
Product Status not for new design not for new design
Infineon Package
PG-VQFN-40
PG-VQFN-40
Package Name QFN-40 (002-13583) QFN-40 (002-13583)
Packing Size 5000 490
Packing Type TAPE & REEL TRAY
Moisture Level 3 3
Moisture Packing DRY DRY
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:

Product Status not for new design
Infineon Package
PG-VQFN-40
Package Name QFN-40 (002-13583)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status not for new design
Infineon Package
PG-VQFN-40
Package Name QFN-40 (002-13583)
Packing Size 490
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CYW20719 is a Bluetooth® Core 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. The device is intended for use in audio, IoT, sensors (medical, home, security, and so forth) and human interface device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, the CYW20719 employs high level of integration to reduce external components.

Features

  • 96-MHz Arm® Cortex®-M4 MCU
  • Floating point unit (FPU)
  • Supports serial wire debug (SWD)
  • Runs Bluetooth® stack and application
  • Execute from on-chip flash or RAM
  • Adaptive Frequency Hopping (AFH)​
  • TX power 5 dBm​
  • RX sensitivity -95.5 dBm (Bluetooth® LE)

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications

Diagrams

CYW20719 Block Diagram
CYW20719 Block Diagram
CYW20719 Block Diagram CYW20719 Block Diagram CYW20719 Block Diagram
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Documents

Documents

Design resources

Partner solutions

Developer community

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