Double DPAK (DDPAK)

Innovative top-side cooled SMD solution for high power applications

Infineon Technologies introduces the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technologies 600V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650V G6 are combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

SMD based SMPS designs support fast switching and help to reduce the parasitic inductance associated with long leaded packages such as the common TO-220 package. In today’s SMD based designs, the output power is restricted by the thermal limit of the PCB material because the heat must be dissipated through the board. Thanks to the top-side cooling concept of DDPAK, the thermal decoupling of board and semiconductor is possible, enabling higher power density or improved system lifetime.

~20 percent higher power dissipation

DDPAK based SMD solutions allow to reach up to 20 percent higher power dissipation on the board temperature level of a standard cooling concept enabling higher power density at a given form factor.

~12°C lower board temperature

DDPAK based SMD solutions allow to drive the application at around 12°C lower board temperature on the output power level of a standard cooling concept leading to increased system lifetime.

DDPAK offers an inbuilt 4pin Kelvin source configuration and very low parasitic source inductance. The seperate pin "source-sense" delivers undisturbed singals to the driver and therefore increases the ease-of–use level. The combination of this 4pin functionality together with Infineon’s latest superjunction MOSFET and CoolSiC™ Schottky diode technologies ensures highest efficiency levels and allows customers to reach the 80 PLUS^® Titanium standard.