Active and preferred
RoHS Compliant

F3L25R12W1T4_B27

1200 V, 25 A 3-level IGBT module
ea.
in stock

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F3L25R12W1T4_B27
F3L25R12W1T4_B27
ea.

Product details

  • Configuration
    3-level
  • Dimensions (length)
    48 mm
  • Dimensions (width)
    33.8 mm
  • Features
    PressFIT, Phase leg
  • Housing
    EasyPACK™ 1B
  • IC(nom) / IF(nom)
    25 A
  • IC max
    45 A
  • Qualification
    Industrial
  • Technology
    IGBT4 - T4
  • VCE(sat) (Tvj=25°C typ)
    1.85 V
  • VF (Tvj=25°C typ)
    1.35 V
  • Voltage Class max
    1200 V
OPN
F3L25R12W1T4B27BOMA1
Product Status active and preferred
Infineon Package AG-EASY1B
Package Name N/A
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package AG-EASY1B
Package Name -
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyPACK™ 1B 1200 V, 25 A 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, NTC and PressFIT Contact Technology.

Features

  • Fast trench IGBT4
  • Low inductive design
  • Low switching losses
  • Low VCEsat
  • Al2O3 substrate
  • Compact design
  • PressFIT contact technology
  • Rugged mounting due to
  • Integrated mounting clamps

Applications

Documents

Design resources

Developer community

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