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GaN HEMTs represents a key technology for modern power electronics systems, providing high efficiency and power density. Infineon’s CoolGaN™ HEMT families and EiceDRIVER™ gate driver ICs are designed to provide the best possible performance in GaN-based systems, minimizing R&D effort and cost. Infineon offers a broad range of EiceDRIVER™ gate driver ICs, optimized for driving GaN GIT (gate injection transistor) and SG (Schottky gate) HEMTs.

An innovative differential gate drive concept has been implemented in tailor-made EiceDRIVER™ 1EDx56x3 gate driver ICs to address the specifics of Infineon's CoolGaN™ GIT technology concept. These drivers ensure robust and highly efficient operation of the high-voltage GaN switch, and at the same time concurrently minimize R&D efforts and shortening time to market. Nevertheless, in many applications, standard gate driver ICs with right fit UVLO protection can also be employed when coupled to an RC circuit to generate both the required small steady-state current and the turn-on/turn-off peak currents. Dual-channel drivers of the EiceDRIVER™ 2EDxx259 product family feature dead-time control and shoot-through protection to ensure safe operation in half-bridge topologies using a single IC. To summarize, the single-channel and dual-channel gate driver ICs of the EiceDRIVER™ family are the best choices to match with Infineon’s CoolGaN™ GIT HEMTs and other 650 V GaN HEMTs technologies (e.g., Schottky gate, Cascode) to achieve an optimum combination of efficiency, power density, and robustness in high-performance power conversion applications.

High efficiency and high power density are key requirements for modern power electronics systems, which are enabled by state-of-the-art GaN HEMTs. The right gate driver IC can help designers achieve the best performance in their GaN-based systems, while simultaneously minimizing R&D efforts and associated costs. In addition to its high-performance CoolGaN™ HEMT families, Infineon Technologies offers a broad range of EiceDRIVER™ gate driver ICs optimized for driving CoolGaN™ SG HEMTs and CoolGaN™ GIT HEMTs, strategically designed to provide the best-in-class system solutions for target applications.

One key difference between these two structures is the gate metallization: The GIT HEMT uses an ohmic gate contact, and the SG HEMT uses a Schottky gate contact. The GIT gate is non-insulated and thereby very rugged against overvoltage, due to the self-clamping nature of the equivalent diode between the gate and channel. The Schottky gate is “semi-isolated” by the back-to-back diodes, preventing significant current flow to emulate a conventional MOSFET gate.

GaN HEMTs represents a key technology for modern power electronics systems, providing high efficiency and power density. Infineon’s CoolGaN™ HEMT families and EiceDRIVER™ gate driver ICs are designed to provide the best possible performance in GaN-based systems, minimizing R&D effort and cost. Infineon offers a broad range of EiceDRIVER™ gate driver ICs, optimized for driving GaN GIT (gate injection transistor) and SG (Schottky gate) HEMTs.

An innovative differential gate drive concept has been implemented in tailor-made EiceDRIVER™ 1EDx56x3 gate driver ICs to address the specifics of Infineon's CoolGaN™ GIT technology concept. These drivers ensure robust and highly efficient operation of the high-voltage GaN switch, and at the same time concurrently minimize R&D efforts and shortening time to market. Nevertheless, in many applications, standard gate driver ICs with right fit UVLO protection can also be employed when coupled to an RC circuit to generate both the required small steady-state current and the turn-on/turn-off peak currents. Dual-channel drivers of the EiceDRIVER™ 2EDxx259 product family feature dead-time control and shoot-through protection to ensure safe operation in half-bridge topologies using a single IC. To summarize, the single-channel and dual-channel gate driver ICs of the EiceDRIVER™ family are the best choices to match with Infineon’s CoolGaN™ GIT HEMTs and other 650 V GaN HEMTs technologies (e.g., Schottky gate, Cascode) to achieve an optimum combination of efficiency, power density, and robustness in high-performance power conversion applications.

High efficiency and high power density are key requirements for modern power electronics systems, which are enabled by state-of-the-art GaN HEMTs. The right gate driver IC can help designers achieve the best performance in their GaN-based systems, while simultaneously minimizing R&D efforts and associated costs. In addition to its high-performance CoolGaN™ HEMT families, Infineon Technologies offers a broad range of EiceDRIVER™ gate driver ICs optimized for driving CoolGaN™ SG HEMTs and CoolGaN™ GIT HEMTs, strategically designed to provide the best-in-class system solutions for target applications.

One key difference between these two structures is the gate metallization: The GIT HEMT uses an ohmic gate contact, and the SG HEMT uses a Schottky gate contact. The GIT gate is non-insulated and thereby very rugged against overvoltage, due to the self-clamping nature of the equivalent diode between the gate and channel. The Schottky gate is “semi-isolated” by the back-to-back diodes, preventing significant current flow to emulate a conventional MOSFET gate.

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