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Implementation of new Edge ProtectionTM Technology for VQFN Packages

The purpose of this document is to provide a comprehensive description on the VQFN48 package. The scope applies to Punch VQFN with dimple from subcon, Amkor using new Edge ProtectionTM technology (Blacktop) with the improved dimple dimension and enhanced traceability. Technical aspects and settings including AOI should be considered in the board mounting process.

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Jun 05, 2023