Active and preferred
RoHS Compliant

F3L225R07W2H3P_B63

650 V, 225 A 3-level IGBT module
Data Sheet

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F3L225R07W2H3P_B63
F3L225R07W2H3P_B63
Data Sheet

Product details

  • Configuration
    3-level
  • Dimensions (length)
    56.7 mm
  • Dimensions (width)
    48 mm
  • Features
    Phase leg, PressFIT, TIM
  • Housing
    EasyPACK™ 2B
  • IC(nom) / IF(nom)
    225 A
  • IC max
    225 A
  • Qualification
    Industrial
  • Technology
    IGBT HighSpeed 3
  • VCE(sat) (Tvj=25°C typ)
    1.4 V
  • VCES / VRRM
    650 V
  • VF (Tvj=25°C typ)
    1.55 V
  • Voltage Class max
    650 V
Recommended
OPN
F3L225R07W2H3PB63BPSA1
Product Status active and preferred
Infineon Package AG-EASY2B
Package Name N/A
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-EASY2B
Package Name -
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
EasyPACK™ 2B 650 V 225 A 3-level phase leg IGBT module with High Speed IGBT H3, NTC, active "Neutral Point Clamp 2", PressFIT Contact Technology and pre-applied Thermal Interface Material .

Features

  • Low inductive design
  • Low switching losses
  • Low VCEsat
  • Al2O3 substrate
  • Compact design
  • PressFIT contact technology
  • Rugged mounting due to
  • Integrated mounting clamps

Documents

Documents

Design resources

Partner solutions

Developer community

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