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New superior assembly technologies for modules with highest power densities

Power module development is striving for higher power densities, not only in new but also in already established packages. Two main challenges for such kinds of upgrades are to meet the increased requirements towards ampacity and heat dissipation. These new requirements may enforce adjustments in the utilized packaging technologies to overcome the given package limitations. The current article investigates the challenges of increased power densities in existing module packages and how they can be mastered. In this article, it is proven that established IGBT power module packages can be toughened up for significantly higher power densities by consequent implementation of new, beneficial assembly technologies. This is also demonstrated by means of a newly developed half-bridge module in the well established EconoDUAL™ 3 housing that provides, in combination with Infineon’s latest 4th generation IGBTs, up to 30% more output power. Offering higher power densities in established module packages includes the advantage to upgrade existing inverter designs to higher output powers without changing the mechanical set-up, making this approach a fast, cheap and therefore very attractive opportunity.

• 1.00 MB
• Jan 31, 2011