Active and preferred
RoHS Compliant

IQE022N06LM5SC

OptiMOS™ 5 power MOSFET 60 V logic level in PQFN 3.3x3.3 Source-Down DSC package
ea.
in stock

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IQE022N06LM5SC
IQE022N06LM5SC
ea.

Product details

  • Budgetary Price €/1k
    1.11
  • ID (@25°C) max
    151 A
  • IDpuls max
    604 A
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PQFN 3.3x3.3 Source-Down
  • Polarity
    N
  • Ptot max
    100 W
  • QG (typ @4.5V)
    26 nC
  • QG (typ @10V)
    53 nC
  • RDS (on) (@4.5V) max
    2.9 mΩ
  • RDS (on) (@10V) max
    2.2 mΩ
  • Special Features
    Dual-Side Cooling
  • VDS max
    60 V
  • VGS(th)
    1.7 V
OPN
IQE022N06LM5SCATMA1
Product Status active and preferred
Infineon Package
Package Name PQFN 3.3x3.3 Source-Down DSC
Packing Size 6000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name PQFN 3.3x3.3 Source-Down DSC
Packing Size 6000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
IQE022N06LM5SC is Infineon’s new best-in-class OptiMOS™ 5 power MOSFET 60 V logic level in PQFN 3.3x3.3 Source-Down dual-side cooling (DSC) package, offering the industry’s lowest on-state resistance RDS(on) at 25˚C and superior thermal performance. The OptiMOS™ Source-Down is a revolutionary design with a flipped silicon die inside, which offers several advantages, such as increased thermal capability, advanced power density and improved layout possibilities. Combined with the innovative dual-side cooling package, which can dissipate up to three times more power than the traditional overmolded package, IQE022N06LM5SC is targeted for high power density and performance SMPS products commonly found in telecom and data servers.

Features

  • Logic level allows lower Qrr
  • Reduced RDS(on) by up to 30%
  • Improved RthJCover PQFN
  • New, optimized layout possibilities

Benefits

  • Enabling highest power density
  • Superior thermal performance
  • Efficient layout for space use
  • Reduced PCB losses

Applications

Documents

Design resources

Developer community

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