Active and preferred

CY7C1441KV33-133BZM

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CY7C1441KV33-133BZM
CY7C1441KV33-133BZM

Product details

  • Architecture
    Standard Sync, Flow-through
  • Bank Switching
    N
  • Data Width
    x 36
  • Density
    36 MBit
  • ECC
    N
  • Family
    Standard Sync
  • Frequency
    133 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    N
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    3.14 V to 3.63 V
  • Organization (X x Y)
    1Mb x 36
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Military
  • Read Latency (Cycles)
    1
OPN
CY7C1441KV33-133BZM
Product Status active and preferred
Infineon Package
Package Name FBGA-165 (51-85195)
Packing Size 105
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant No
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name FBGA-165 (51-85195)
Packing Size 105
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Our synchronous SRAMs are volatile memories ideal to meet the processing power demands for defense processing systems and communication equipment. These memories meet automotive quality and are designed and built with ultimate performance and reliability in mind.

Features

  • 36 Mbit Density
  • 1M x 36 organization
  • 6.5ns access speed
  • 165-ball FBGA package
  • –55 °C to 125 °C mil-temp range

Applications

Documents

Design resources

Developer community

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