Active and preferred
RoHS Compliant
Lead-free

CYT4BFCCHDQ0BZEGS

A TRAVEO™ Microcontroller designed for automotive body applications offering a frequency of 350 MHz, up to 8Mb of Flash and a 320-BGA Package
Data Sheet
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CYT4BFCCHDQ0BZEGS
CYT4BFCCHDQ0BZEGS
Data Sheet

Product details

  • 16bit TCPWM (Motor control)
    15
  • 16bit TCPWM
    87
  • 32bit TCPWM
    16
  • ADC Channel
    96
  • ASIL/SIL support
    ASIL-B
  • CAN-FD
    10
  • Classification
    ISO 26262-compliant
  • CXPI
    0
  • Cybersecurity Classification
    ISO 21434-ready
  • Debug Interface
    SWD/JTAG/Trace
  • DMA Channels
    143/65/8
  • eMMC IO speed
    NA
  • eMMC
    1
  • eSHE/HSM
    HSM
  • Ethernet Ports
    2
  • Ethernet speed
    10/100/1000
  • External Interrupt channel
    240
  • Family
    TRAVEO™ T2G CYT4BF Series
  • Flash Security
    Yes
  • Flash
    8384 kByte
  • FlexRayTM
    2
  • Floating Point Unit
    Dual precision
  • GPIO
    240
  • I2S
    TX 3ch, RX 3ch (3 instances)
  • LIN
    20
  • Main Core frequency
    350 MHz
  • Main Core type/Crypto Core type
    ARM_CM7F_D/CM0+
  • MPU
    Yes
  • Operating temperature range TA
    -40°C to 125°C
  • PPU
    Yes
  • RC-OSC
    No
  • RTC channel
    1
  • SCB Blocks
    11
  • Smart IOs
    36
  • SMIF (SPI/HyperBus)
    1
  • SMIF speed
    3.3V I/O at 100MHz
  • SRAM
    1024 kByte
  • Supply Voltage
    2.7 to 5.5
  • Temperature sensor
    Yes
  • Watchdog
    Yes
  • Work Flash
    256 kByte
Recommended
OPN
CYT4BFCCHDQ0BZEGS
Product Status active and preferred
Infineon Package
PG-LFBGA-320
Package Name FBGA-320 (002-23091)
Packing Size 900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-LFBGA-320
Package Name FBGA-320 (002-23091)
Packing Size 900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
CYT4BFCCHE belongs to the TRAVEO™ CYT4BF Family of MCUs, based on the highly-efficient embedded processor Arm® Cortex®-M7F, it ensures high level efficiency and network connectivity while preserving ease-of-use, a minimal power consumption through its featured power modes and a great cutting-edge security through HSM (Hardware Security Module), dedicated Cortex®-M0+ for secure processing, and embedded flash in dual bank mode for FOTA requirements. Desiged for automotive body applications, it is a great fit for body control modules, gateway, and infotainment applications.

Features

  • 350-MHz Arm® Cortex®-M7F Dual
  • 8384 KB code flash, 256 KB work flash and 1024 KB SRAM
  • 87-ch 16-bit and 16-ch 32-bit Timer Counter Pulse Width Modulator (TCPWM)
  • 7 to 5.5 Supply Voltage
  • HSM (Hardware Security Module)
  • 240x programmable GPIO
  • 11x SCB / 20x LIN / 10x CAN FD Channels
  • 2x FlexRay Channels
  • 216x DMA Channels
  • -40°C - +125 °C Temperature Range
  • 320-BGA Package

Benefits

  • Supplied with optimized software platform that is available for Infineon Autosar MCAL (Microcontroller Abstraction Layer) self-test libraries, Flash EEPROM emulation, as well as security low level drivers, combined with third-party firmware.
  • Safety level ASIL-B.
  • Great scalable connectivity through its 10x serial communication block SCB / 17x LIN / 10x CAN FD Channels
  • Supports frequent data changes with faster, more secure communication via Ethernet AVB (Audio Video Bridging), CAN-FD and FlexRay.
  • Supports Ethernet Communication with 10/100/1000 Speed.
  • Supports I2S Connectivity with TX 3 Channels and RX 2 Channels.

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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