Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
View replacement
END OF LIFE
discontinued
RoHS Compliant
Lead-free

S25FL127SABMFV103

END OF LIFE

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

Product details

  • Density
    128 MBit
  • Family
    FL-S
  • Interface Bandwidth
    54 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    108 / -
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Matte Tin Plating
  • Operating Temperature
    -40 °C to 105 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Qualification
    Industrial
OPN
S25FL127SABMFV103
Product Status discontinued
Infineon Package
Package Name SOIC-8 (002-15548)
Packing Size 2100
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
Package Name SOIC-8 (002-15548)
Packing Size 2100
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S25FL127SABMFV103 is a 128 Mb (16 MB) SPI NOR flash memory using 65-nm MIRRORBIT™ technology and Eclipse architecture, supporting single, dual, and quad SPI interfaces for high-speed operation. It operates from 2.7 V to 3.6 V, is AEC-Q100 qualified, and functions across -40°C to 125°C.

Features

  • CMOS 3.0 V core
  • 128 Mb (16 MB) density
  • SPI with multi-I/O support
  • 24- or 32-bit address options
  • Read commands: Normal, Fast, Dual, Quad
  • AutoBoot for automatic read on power-up/reset
  • 256- or 512-byte page programming buffer
  • Internal ECC with single bit error correction
  • Hybrid and uniform sector erase options
  • 100,000 program-erase cycles per sector
  • 20 year data retention
  • 1024-byte one-time programmable (OTP) array

Benefits

  • Low voltage operation reduces power use
  • High density enables large code/data storage
  • Flexible SPI I/O boosts system compatibility
  • Extended addressing supports large designs
  • Multiple read modes optimize speed
  • AutoBoot accelerates system startup
  • Large buffers speed up programming
  • ECC improves data reliability
  • Flexible erase options fit various needs
  • High endurance lowers maintenance cost
  • Long retention ensures data safety
  • OTP region adds secure storage

Applications

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }