Active and preferred

EVAL_5BR3995BZ_BUCK1

5.4 W non-isolated high-voltage buck converter evaluation board
Application Notes
ea.
in stock

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EVAL_5BR3995BZ_BUCK1
EVAL_5BR3995BZ_BUCK1
ea.
Application Notes

Product details

  • Board Type
    Evaluation Board
  • Device
    ICE5BR3995BZ
  • Dimensions
    70 (L) x 35 (W) x 30 (H) mm
  • Family
    CoolSET™
  • Frequency
    65 kHz
  • Input Type
    AC
  • Input Voltage
    230 V
  • Iout
    0.2 A
  • Isolated
    No
  • Output Current
    0.2 A
  • Output Voltage
    18 V
  • Pout max
    5.4 W
  • Product Name
    EVAL_5BR3995BZ_BUCK1
  • Qualification
    Industrial
  • Sub Application
    Offline SMPS
  • Target Application
    Power Supplies, Industrial, Consumer, SMPS, Metering, Home Appliances
  • Topology
    Buck
Recommended
OPN
EVAL5BR3995BZBUCK1TOBO1
Product Status active and preferred
Infineon Package --
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant No
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package --
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The EVAL_5BR3995BZ_BUCK1 is an evaluation board configured in a non-isolated high-voltage buck topology and features the ICE5BR3995BZ , a product of Infineon’s 5th generation fixed frequency CoolSET™ family .Designers can evaluate the performance of the buck converter quickly and easily, thanks to:An ultra-wide input range of up to 460 VAC with a single 18 V / 300 mA outputPlaceholders for dual LDOsImplemented off-the-shelf components

Features

  • Ultra wide input 85~460 VAC
  • Single non-isolated output 18 V / 300 mA
  • > 71% full-load efficiency @ 230 VAC

Benefits

  • Cost-efficient buck topology for non-isolated auxiliary power supply
  • Ease of evaluation with placeholders for dual LDOs to support different output requirements
  • Ease of mock-up with off-the-shelf components and dual footprint to support SMD or through-hole power inductor

Applications

Bill of Material

Documents

Documents

Design resources

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