Active and preferred
RoHS Compliant
Lead-free

IMCQ120R053M2H

CoolSiC™ MOSFET discrete 1200 V G2 in top-side cooled Q-DPAK package
Data Sheet
package
ea.
in stock

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IMCQ120R053M2H
IMCQ120R053M2H
ea.
Data Sheet

Product details

  • Ciss
    1270 pF
  • Coss
    41 pF
  • ID (@25°C) max
    43 A
  • Mounting
    SMD
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PG-HDSOP-22
  • Pin Count
    22 Pins
  • Polarity
    N
  • Ptot (@ TA=25°C) max
    234 W
  • Qgd
    6.7 nC
  • QG
    32.8 nC
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    52.6 mΩ
  • RthJA max
    67 K/W
  • RthJC max
    0.64 K/W
  • Technology
    CoolSiC™ G2
  • Tj max
    200 °C
  • VDS max
    1200 V
Recommended
OPN
IMCQ120R053M2HXTMA1
Product Status active and preferred
Infineon Package
PG-HDSOP-22
Package Name Q-DPAK
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-HDSOP-22
Package Name Q-DPAK
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CoolSiC™ MOSFET discrete 1200 V, 53 mΩ G2 in a top-side cooled Q-DPAK package specifically designed for wide use in industrial application. The Q-DPAK package solution provides customers with an outstanding thermal performance, easier assembly and reduced system cost. The top-side cooled Q-DPAK single switch is introducing a new era in cooling, energy efficiency, design flexibility and performance.

Features

  • VDSS = 1200 V @Tvj = 25°C
  • IDDC = 31 A @TC = 100°C
  • RDS(on) = 52.6 mΩ @VGS = 18 V, Tvj = 25°C
  • Very low switching losses
  • Overload operation up to Tvj = 200°C
  • Short circuit withstand time 2 µs
  • Benchmark gate threshold voltage
  • Robust against parasitic turn on
  • Robust body diode for hard commutation
  • .XT interconnection technology

Benefits

  • Outstanding thermal performance
  • Increases energy efficiency
  • Higher power density
  • More compact and easier designs
  • Lower TCO cost or BOM cost

Documents

Documents

Design resources

Partner solutions

Developer community

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