We power AI – from the grid to the core, today and in the future. At Infineon, we are pioneering innovative solutions that transform the entire power flow within and beyond AI data centers. Our unique systems expertise enables us to push the boundaries of what’s possible and shape the future of the industry.

Infineon is an exciting place to work for talented professionals from a wide range of backgrounds, including Applications Engineers, Field Applications Engineers, and Design Engineers, as well as experts in firmware and software development, and many other disciplines. Our teams work together to drive innovation in areas such as analog & digital design in DCDC power management, magnetics design, thermal and mechanical simulations, control loop architecture, and DCDC Point of Load solutions. We also explore emerging technologies like 3D packaging, LV GaN technology, and product engineering with a focus on design for manufacturing.

With opportunities to work on cutting-edge projects, collaborate with cross-functional teams, and contribute to the development of industry-leading solutions, our employees are empowered to grow and thrive in their careers. Join our team and explore the many opportunities available to you. Are you ready to be part of the journey?

Join a dynamic team designing power system architectures, topologies, and advanced mixed-signal power management ICs that fuel hyperscale computing, data communications, and telecom devices. We welcome versatile innovators, offer attractive career paths and a global environment, and provide the support and resources needed to help you succeed in your role.

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The exponential power demand of AI drives a need for innovation and development of advanced semiconductor solutions that handle the complex power conversion processes within AI data centers.

Our innovative portfolio of power semiconductors includes solutions ranging from the grid entering the data center to its core, the AI processor and leverages the benefits of Si, SiC and GaN to achieve the highest efficiency, power density, robustness and reliability and best-in-class TCO.