CoolMOS™ packages

Revolutionary CoolMOS™ superjunction MOSFET technologies require innovative package solutions to enable tomorrow's trends

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CoolMOS™ superjunction (SJ) MOSFETs in innovative package solutions

Low-power applications are typically sold into the price sensitive consumer world where customers are closely looking into bill of material (BOM) cost savings. To allow savings, Infineon offers special package features that avoid additional assembly treatments on the customer's side as well as smaller packages, enabled by our outstanding CoolMOS™ superjunction technology.

CoolMOS™ technology in low- and high-power MOSFET package types

High-power applications are very performance oriented. To further improve efficiency and thermal behavior, even considering smaller form factors, Infineon introduced packages with Kelvin-Source functionality and with DDPAK, the first top-side cooled SMD package. Combine the benefits of the high voltage technologies 600 V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650 V G6 with the innovative concept of top-side cooling in DDPAK, and now also QDPAK.

Best-fit solution for your design with the broadest range of packages

The CoolMOS™ devices are packaged in a wide range of packages, in through-hole or surface -mount, top-side or bottom-side cooling versions, fitting all associated application with the right performance and cost. To address concerns with dual sourcing, all of these packages, including the most innovative top-side cooling, are part of the JEDEC standard. In addition, Infineon has invested into in-house capacity for back-end production to provide a secure supply chain. At Infineon we continue to innovate in the area of packaging, providing products of outstanding quality and reliability.

CoolMOS™ superjunction (SJ) MOSFETs in innovative package solutions

Low-power applications are typically sold into the price sensitive consumer world where customers are closely looking into bill of material (BOM) cost savings. To allow savings, Infineon offers special package features that avoid additional assembly treatments on the customer's side as well as smaller packages, enabled by our outstanding CoolMOS™ superjunction technology.

CoolMOS™ technology in low- and high-power MOSFET package types

High-power applications are very performance oriented. To further improve efficiency and thermal behavior, even considering smaller form factors, Infineon introduced packages with Kelvin-Source functionality and with DDPAK, the first top-side cooled SMD package. Combine the benefits of the high voltage technologies 600 V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650 V G6 with the innovative concept of top-side cooling in DDPAK, and now also QDPAK.

Best-fit solution for your design with the broadest range of packages

The CoolMOS™ devices are packaged in a wide range of packages, in through-hole or surface -mount, top-side or bottom-side cooling versions, fitting all associated application with the right performance and cost. To address concerns with dual sourcing, all of these packages, including the most innovative top-side cooling, are part of the JEDEC standard. In addition, Infineon has invested into in-house capacity for back-end production to provide a secure supply chain. At Infineon we continue to innovate in the area of packaging, providing products of outstanding quality and reliability.

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