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Superior thermal stability by enhanced base plate design combined with dedicated Thermal Interface Material

New developments in power electronic components focus on three major aspects. Electric improvements target the reduction of switching- and static losses along with EMI behavior. Mechanical changes in the design cope with the improvement of the mechanical robustness as well as thermal aspects. There is a noteworthy difference within these three subjects. Electrical tuning and internal improvements of the overall construction of the power module are done by the semiconductor manufacturer. Thermal aspects however depend on the assembling at the user’s site. The added thermal interface component and the application itself have a large impact on the module’s performance. Care has to be taken to thoroughly consider mounting aspects, the interconnection of the module to the according heat sink and the thermo dynamics throughout the predicted lifetime of the final inverter. Using the example of a module with a larger base plate reveals, how various approaches can help to optimize the module’s base plate to achieve outstanding thermal performance and therefore support the development of highly reliable, long lasting inverter systems.

• 1.65 MB
• 2013/06/27