MEMS microphones

XENSIV™ MEMS microphone features ultra-low self-noise (high SNR), extremely low distortion (THD) even at high sound pressure levels (SPL), tight part-to-part phase and sensitivity matching, a flat frequency response with low-frequency roll-off (LFRO), and ultra-low group delay. With selectable power modes and a very small package size, the XENSIV™ MEMS microphone is an ideal fit for consumer electronics requiring excellent audio capture capabilities.

Infineon’s XENSIV™ MEMS microphone is designed to capture audio signals with unmatched precision and quality. This microphone includes components from Infineon’s world-leading MEMS microphone portfolio.

Thanks to its advanced technical features, high-quality standards, and robust chip-level design, Infineon’s MEMS microphone extends beyond consumer use, supporting applications in medical devices (e.g., patient monitoring) and industrial systems (e.g., predictive maintenance and security).

MEMS microphone uses an electrically charged backplate and a membrane to create a capacitive sound transducer. The membrane moves in response to the amplitude and frequency of sound waves, generating voltage changes that are measured, processed, and output via an integrated analog or digital ASIC. Infineon leverages two core MEMS technologies: Single Backplate Technology (SBP) and Sealed Dual Membrane (SDM).

SBP is an industry standard for mid-range microphones, known for its simplicity and robustness. Infineon’s SBP technology offers an outstanding performance-to-cost ratio, especially for compact packages. It achieves an SNR of up to 69 dB, with IP57 ingress protection and high resistance to compressed air, shocks, and environmental stressors.

SDM represents Infineon’s innovative MEMS microphone technology, using two membranes and a charged stator to create a sealed low-pressure cavity with a differential output signal. This design delivers ultra-high SNR of up to 76 dB, low distortion, and IP57-level protection at the microphone level. SDM is ideal for achieving top-tier acoustic performance in medium and larger package sizes.

Infineon’s XENSIV™ MEMS microphone is designed to excel across a wide range of applications – from consumer devices like smartphones, TWS earbuds, headphones, smart glasses, headsets, laptops, cameras, and smart speakers to automotive systems that ensure safe and comfortable driving, as well as industrial, medical, and robotic solutions. Each application has its own specific requirements, such as low power consumption for TWS earbuds, extended voice pick-up for smart speakers, or high robustness and reliability for automotive systems.

Infineon’s portfolio includes the ideal microphone for every feature set. This versatility allows device manufacturers to rely on Infineon as a single, trusted partner for audio innovation across all applications.

Infineon’s automotive-qualified MEMS microphone meets AEC-Q103-003, the Automotive Electronics Council standard that ensures long-term reliability in harsh automotive environments. This standard emphasizes robustness and reliability but does not specify acoustic performance or functional safety targets, which are outlined in product datasheets and system standards.

The microphone undergoes rigorous environmental, mechanical, electrical, and MEMS-specific tests, including temperature cycling, humidity, vibration/shock, and ESD, ensuring stable performance across automotive temperature ranges. When selecting components, confirm the AEC grade and operating temperature range to ensure they meet your application’s requirements.

Infineon offers a growing portfolio of AEC-Q103-qualified MEMS microphones for immediate integration into automotive programs. Upon request, we can qualify industrial-grade microphones to AEC-Q103 standards, aligning with your timelines. All qualified products are part of Infineon’s longevity program, ensuring extended availability and lifecycle support. We collaborate early to align on grades, scopes, and milestones to ensure a smooth and successful launch.

Infineon is a key player in MEMS microphones and is shaping the future of acoustic MEMS across a wide range of applications. While continuously enhancing microphone performance, we are also unlocking the broader potential of MEMS technology for audio and sound innovations beyond microphones.

• Infineon Vibration Sensor (IVS): Captures sound through vibrations in physical contact, such as bone conduction. Combined with MEMS microphones, it enables crystal-clear audio without wind noise disturbance and facilitates external voice sensing for autonomous vehicles.
• Ultrasonic MEMS transducers: Deliver short-range sensing (30-90 kHz) for detecting objects within 1-50 cm. Compact, energy-efficient, and immune to lighting conditions, they support applications like gaze tracking and blink detection for hands-free control in AI and AR glasses.
• SoundWire-I3S (SWI3S): A cutting-edge audio interface standard supporting up to 12 peripherals on a two-wire bus with control signaling. It powers scalable, power-efficient microphone arrays with synchronized audio capture, reducing wiring for AI and AR glasses.
• MEMS speakers
• PMUT, CMUT

In this section, you will find informative and engaging online webinars about MEMS microphones. From the fundamentals of MEMS microphones to their practical implementation in real-world applications, our online resources cover a wide range of topics to help you stay up to date with the latest advancements in this rapidly evolving field.

Check out our curated online content and stay ahead in the world of MEMS microphones: