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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
Business & Financial Press
Aug 21, 2026
Business & Financial Press
Aug 10, 2026
Quarterly Report
Aug 05, 2026
Business & Financial Press
Jul 13, 2026
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Packages
Infineon offers a comprehensive range of packaging options that caters to a diverse array of products, encompassing various configurations and technologies such as surface mounted devices, through hole devices, and module packages.
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Board Assembly Recommendations (General)
Board Assembly Recommendations (General)
Additional information about the board mounting of Infineon devices
Board Mounting Guidelines
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Feb 27, 2026
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