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Package Categories

Through Hole Devices

Single Small Outline Packages
- PG-SSO
- PG-SSOM
- PG-SSOA11
Single and Dual In-Line Packages
- PG-DIP
Ceramic Packages
- C-DIP
Flatpacks
- CG-FP
Plastic Through-Hole TO Packages
- PG-TO220
- PG-TO251
- PG-TO262
- PG-TO247
- PG-HSIP247
Metal Through-Hole TO Packages
- M-TO257
- M-TO254
- M-TO204
- M-TO259
- M-TO258
- M-TO205

Surface Mounted Devices

Integrated Device Packages without Leads
- PG-TISON
- PG-IQFN
- PG-WISON
- PG-TIQFN
- PG-VIQFN
- PG-VITFN
- PG-WHITFN
Pressure Sensor Packages with Open Signal Port
- PG-DSOF
- PG-DSOSP
- PG-DFN
Ball Grid Array Packages
- PG-BGA
- PG-LFBGA
- PG-FBGA
- PG-LBGA
- PG-FHBGA
- P-BGA
- PG-FCBGA
- P-LFBGA
- PG-TFBGA
- P-TFBGA
- PG-VFBGA
- P-VFBGA
Ball Grid Array Packages for Radar Sensors
Leadless Packages for Discretes
- PG-TDSON
- PG-TSDSON
- PG-HSOF
- PG-TSON
- PG-VSON
- PG-WSON
- PG-USON
- PG-VDSON
- PG-LSON
- PG-TTFN
- PG-WHTFN
- PG-WHSON
- PG-LHSOF
- PG-XSON
Packages with Dual Row Gullwing Leads
- PG-DSO
- PG-TSSOP
- PG-SSOP
- P-TSSOP
- PG-TDSO
- PG-TSDSO
- P-DSO
- PG-TSOP
- PG-HDSOP
- PG-LHDSO
- PG-LDSO
Diode and Transistor Packages
- PG-SOT23
- P-SOT223
- PG-SOT323
- PG-SOT363
- PG-SC74
- PG-SOT223
- PG-SOT343
- PG-SC59
- PG-SOT143
- PG-TSOP6
- PG-SOD323
- PG-SCT595
- P-SOT143
Metal Can Packages for DirectFET™ Transistors
- MG-WDSON
LGA Type Sensor Packages with Open Signal Port
- PG-VLGA
- PG-LLGA
- PG-WLGA
- PG-TLGA
Quad Flat Packages
- PG-LQFP
- PG-MQFP
- PG-TQFP
- P-TQFP
Plastic Surface Mount TO Type Packages
- PG-TO263
- PG-TO252
- P-TO263
- P-TO252
- PG-HSOG
- PG-LHSOG
Small Leadless and Non-leaded Packages
- PG-TSLP
- PG-TSSLP
- PG-ATSLP
- PG-TSNP
Wafer Level BGA
- PG-WFWLB
- SG-WFWLB
- SG-FWLP
- PG-VFWLB
- SG-XFWLB
- SG-UFWLB
Bare Die Diode Packages
- SG-WLL
Single and Dual In-Line Packages
- M-SIP
Laminate Land Grid Array Packages
- LG-UIQFN
- LG-WIQFN
- PG-TFLGA
- PG-ULGA
- PG-UFLGA
Quad-flat no-lead Packages
- PG-VQFN
- PG-UQFN
- PG-X2QFN
Ceramic Packages
- C-CGA
- C-LCC
- CG-LCC
- CG-LGA
- CG-SSOP
- CG-TSOP
- C-CCN
- C-SOG
Flatpacks
- C-FP
- M-FP
Flat Lead Packages
- PG-SOT89
- PG-SC79
- PG-TSFP
Packages with J-Wing Terminations
- PG-LCC
- P-LCC
- PG-SOJ

Module Packages

Single and Dual In-Line Packages
- PG-SIP
LGA Type Module Packages
- LG-MLGA
Molded Power Modules
- PG-MDIP

Board Assembly Recommendations (General)

Board Assembly Recommendations (General)

Additional information about the board mounting of Infineon devices

Board Mounting Guidelines

pdf

3.04 mb

Dec 05, 2025

Package Technologies

Find out more about examples of Infineon high performance package technologies

Perfect choice for future automotive applications up to 250 A

Perfect choice for future automotive applications up to 250 A

New 7x8 mm² power MOS package

sTOLL

Optimized for High Current Automotive MOSFET Applications

Optimized for High Current Automotive MOSFET Applications

TO-Leadless (TOLL)

The PG-HSOF is a perfect solution for high power applications, where highest efficiency, outstanding EMI behavior, best thermal behavior in combination with space reduction are required

Infineon's power MOSFETs in TOLL, TOLG, and TOLT

Infineon's power MOSFETs in TOLL, TOLG, and TOLT

OptiMOS™ TOLx package family

Addressing high-power (TOLL), better TCoB robustness (TOLG), superior thermal performance (TOLT)

Latest space saving and high performance packages

Latest space saving and high performance packages

OptiMOS™ and StrongIRFET™ Latest Packages

Power Block, TO-Leadless, DirectFET™, SuperSO8 5x6, SuperSO8 5x6 DSC, Source-Down, sTOLL, PQFN 3.3x3.3, PQFN 2x2, TOLT, TOLG

IGBT Discrete market leadership through groundbreaking innovation and application focus

IGBT Discrete market leadership through groundbreaking innovation and application focus

IGBT Discretes

D²PAK, DPAK, SOT-223, TO220, TO220FP, TO247, TO247-4, TO247PLUS, TO-247PLUS-4, TO247 Advanced Isolation

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