Active and preferred
RoHS Compliant
Lead-free

S80KS5123GABHV020

Data Sheet
package
ea.
in stock

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S80KS5123GABHV020
S80KS5123GABHV020
ea.
Data Sheet

Product details

  • Density
    512 MBit
  • Family
    KS-3
  • Initial Access Time
    35 ns
  • Interface Bandwidth
    400 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 200
  • Interfaces
    xSPI (Octal)
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    1.7 V to 2 V
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    See roadmap
  • Qualification
    Industrial
  • Technology
    HYPERRAM
Recommended
OPN
S80KS5123GABHV020
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-15550)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-15550)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
S80KS5123GABHV020 is a 512 Mb HYPERRAM™ self-refresh DRAM with an octal xSPI DDR interface for high-bandwidth memory expansion in embedded and automotive designs. It operates from 1.7 V to 2.0 V and supports up to 200 MHz clock for up to 400 MBps (3,200 Mbps) throughput with 35 ns maximum access time. Configurable linear or wrapped bursts and hybrid sleep plus deep power down (30 µA at 105°C) help manage power.

Features

  • Octal xSPI interface with CS#
  • 8-bit DQ[7:0] data bus
  • DDR data on both clock edges
  • 200 MHz maximum clock rate
  • Up to 400 MBps data throughput
  • 35 ns maximum access time (tACC)
  • RWDS strobe, mask, latency flag
  • Configurable bursts: linear or wrap
  • Wrap bursts: 16/32/64/128 bytes
  • Hybrid sleep via CR1[5], retains data
  • Deep power down via CR0[15]
  • VCC supply range 1.7 V to 2.0 V

Benefits

  • Connects to xSPI host controllers
  • High bandwidth for code/data fetch
  • DDR boosts throughput per clock
  • 200 MHz supports fast memory access
  • 35 ns tACC cuts read latency
  • RWDS eases timing margin closure
  • Burst modes match cache-line reads
  • Wrapped bursts reduce bus overhead
  • Hybrid sleep saves power, keeps data
  • Deep power down minimizes leakage
  • Active clock stop saves stalled power
  • 1.8 V rails without extra supplies

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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