Active and preferred
RoHS Compliant
Lead-free

S70FL01GSAGBHBC10

ea.
in stock

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S70FL01GSAGBHBC10
S70FL01GSAGBHBC10
ea.

Product details

  • Classification
    ISO 26262-ready
  • Density
    1 GBit
  • Family
    FL-S
  • Interface Bandwidth
    52 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / -
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    2.7 V to 3.6 V
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2035
  • Qualification
    Automotive
OPN
S70FL01GSAGBHBC10
Product Status active and preferred
Infineon Package
Package Name FBGA-24 (002-15078)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name FBGA-24 (002-15078)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The S70FL01GSAGBHBC10 is a 1 Gbit (128 Mbyte) FL-S Flash memory with dual-die stack architecture using Infineon's 65 nm MirrorBit® technology. It supports SPI Multi-I/O up to 133 MHz, multiple read modes, and operates from 2.7 V to 3.6 V. With 100,000 program-erase cycles, 20-year data retention, uniform 256-kbyte sectors, advanced sector protection, and AEC-Q100 qualification, it is ideal for automotive, industrial, and embedded applications.

Features

  • Dual-die stack architecture
  • SPI Multi-I/O interface
  • Supports DDR and SDR modes
  • 32-bit extended addressing
  • Page programming buffer: 512 bytes
  • Uniform 256 KB sectors
  • 100,000 program-erase cycles min
  • 20-year data retention min
  • One Time Program (OTP) 2048 bytes
  • Block protection with advanced sector
  • Core voltage: 2.7 V to 3.6 V
  • I/O voltage: 1.65 V to 3.6 V

Benefits

  • Enables 1 Gbit high-density storage
  • Flexible interface for various controllers
  • High-speed data transfer with DDR
  • Large address space for big data
  • Fast programming for efficient updates
  • Simplifies memory management
  • Reliable for frequent rewriting
  • Long-term data reliability
  • Secure storage for sensitive data
  • Prevents accidental data changes
  • Compatible with 3 V systems
  • Flexible I/O for system integration

Applications

Documents

Design resources

Developer community

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