Active and preferred
RoHS Compliant
Lead-free

S26HS01GTFPBHB023

Data Sheet
package

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S26HS01GTFPBHB023
S26HS01GTFPBHB023
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    1 GBit
  • Family
    HS-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    1.7 V to 2 V
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S26HS01GTFPBHB023
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S26HS01GTFPBHB023 is a 1 Gbit SEMPER™ NOR Flash for automotive systems, using the HYPERBUS™ interface at up to 166 MHz DDR (333 MByte/s). It operates from 1.7 V to 2.0 V across -40 to 105°C and supports ISO 26262-compliant designs. Built-in ECC (SECDED), interface and data integrity CRC, SafeBoot, and Advanced Sector Protection help detect errors and protect code and data in safety-critical ECUs.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • HYPERBUS™ DDR read up to 400 MBps
  • JEDEC JESD251 xSPI compatible
  • Data strobe (DS) for read capture
  • Default boot: x1 SPI or x8 HYPERBUS
  • 256 KB uniform or hybrid sectors
  • 256/512-byte page program buffer
  • Embedded ECC on 16-byte data unit
  • SECDED: correct 1-bit, detect 2-bit
  • ECC reporting: INT#, counter, trap
  • Advanced sector protect: DYB/PPB
  • Password-lockable nonvolatile protect

Benefits

  • Higher density per die area
  • Fast execute-in-place reads
  • Simpler JEDEC-based host design
  • More margin at high-speed reads
  • Flexible boot across host modes
  • Optimize erase granularity per use
  • Faster program with fewer writes
  • Automatic correction of bit flips
  • Early detection of double-bit faults
  • Easier ECC fault logging and debug
  • Prevents accidental erase/program
  • Locks protection settings securely

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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