Active and preferred
RoHS Compliant
Lead-free

S26HL512TFPBHI013

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

S26HL512TFPBHI013
S26HL512TFPBHI013

Product details

  • Density
    512 MBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.7 V to 3.6 V
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Industrial
OPN
S26HL512TFPBHI013
Product Status active and preferred
Infineon Package
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
S26HL512TFPBHI013 is a 512 Mbit SEMPER™ NOR flash for code and data storage using a HYPERBUS interface. It operates from 2.7 V to 3.6 V across -40°C to 85°C (industrial) and supports DDR at 166 MHz for up to 333 MByte/s interface bandwidth. Built-in ECC (SECDED), interface CRC, and data integrity CRC improve robustness, while AutoBoot and SafeBoot support reliable boot and recovery.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • HYPERBUS™ DDR read up to 400 MBps
  • JEDEC JESD251 xSPI compatible
  • Data strobe (DS) for read capture
  • Default boot: x1 SPI or x8 HYPERBUS
  • 256 KB uniform or hybrid sectors
  • 256/512-byte page program buffer
  • Embedded ECC on 16-byte data unit
  • SECDED: correct 1-bit, detect 2-bit
  • ECC reporting: INT#, counter, trap
  • Advanced sector protect: DYB/PPB
  • Password-lockable nonvolatile protect

Benefits

  • Higher density per die area
  • Fast execute-in-place reads
  • Simpler JEDEC-based host design
  • More margin at high-speed reads
  • Flexible boot across host modes
  • Optimize erase granularity per use
  • Faster program with fewer writes
  • Automatic correction of bit flips
  • Early detection of double-bit faults
  • Easier ECC fault logging and debug
  • Prevents accidental erase/program
  • Locks protection settings securely

Applications

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }