Active and preferred
RoHS Compliant
Lead-free

S26HL01GTFPBHM033

Data Sheet
package

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S26HL01GTFPBHM033
S26HL01GTFPBHM033
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    1 GBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 125 °C
  • Operating Voltage range
    2.7 V to 3.6 V
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S26HL01GTFPBHM033
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
S26HL01GTFPBHM033 is a 1 Gbit SEMPER™ NOR Flash (HL-T) for automotive code/data storage and execute-in-place over HYPERBUS™. It operates from 2.7 V to 3.6 V across -40°C to 125°C and supports DDR at 166 MHz (333 MByte/s). ISO 26262-compliant functional safety includes ECC (SECDED), interface CRC, data integrity CRC, SafeBoot, AutoBoot, Advanced Sector Protection, and a 1024-byte secure silicon region.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • HYPERBUS™ DDR read up to 400 MBps
  • JEDEC JESD251 xSPI compatible
  • Data strobe (DS) for read capture
  • Default boot: x1 SPI or x8 HYPERBUS
  • 256 KB uniform or hybrid sectors
  • 256/512-byte page program buffer
  • Embedded ECC on 16-byte data unit
  • SECDED: correct 1-bit, detect 2-bit
  • ECC reporting: INT#, counter, trap
  • Advanced sector protect: DYB/PPB
  • Password-lockable nonvolatile protect

Benefits

  • Higher density per die area
  • Fast execute-in-place reads
  • Simpler JEDEC-based host design
  • More margin at high-speed reads
  • Flexible boot across host modes
  • Optimize erase granularity per use
  • Faster program with fewer writes
  • Automatic correction of bit flips
  • Early detection of double-bit faults
  • Easier ECC fault logging and debug
  • Prevents accidental erase/program
  • Locks protection settings securely

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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