Active and preferred
RoHS Compliant
Lead-free

S25HL02GTDPBHB050

Data Sheet
package
board

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

S25HL02GTDPBHB050
S25HL02GTDPBHB050
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    2 GBit
  • Family
    HL-T
  • Interface Bandwidth
    66 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / 66
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    2.7 V to 3.6 V
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S25HL02GTDPBHB050
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
S25HL02GTDPBHB050 is a 2 Gbit SEMPER™ NOR Flash (HL‑T) for automotive code/data storage, using Quad SPI (133 MHz SDR, 66 MHz DDR) with up to 66 MByte/s bandwidth. It operates from 2.7 V to 3.6 V over -40°C to 105°C, and supports ISO 26262-compliant designs with ECC SECDED, SafeBoot, and data integrity CRC. DDP stacks 2 × 1 Gbit die in a 24-ball BGA and is AEC‑Q100 qualified for ECU use.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • Multi-chip package: 2 × 1 Gb dies
  • Uniform or hybrid sector architecture
  • 256 or 512-byte program buffer
  • 1024-byte OTP secure silicon (SSR)
  • Quad SPI: 1-1-4, 1-4-4, 4-4-4
  • Quad SPI DDR read up to 102 MBps
  • ECC on 16-byte units, Hamming code
  • Corrects 1-bit, detects 2-bit errors
  • ECC status, trap address, counter
  • Endurance flex wear leveling regions
  • LBP + ASP sector/block protection

Benefits

  • Higher density lowers PCB footprint
  • Higher capacity in one BOM item
  • Aligns small params + bulk storage
  • Faster program cuts update time
  • Protect keys/IDs from cloning
  • Flexible host interface compatibility
  • Faster boot and code execute in place
  • ECC boosts read data reliability
  • Detects corruption before failure
  • Speeds debug and field diagnostics
  • Wear leveling extends flash lifetime
  • Prevents accidental erase or writes

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }