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IGBT

As a recognized technology leader in IGBT, Infineon offers a comprehensive portfolio in different voltage- and current classes. IGBT products are offered as bare dies, discretes components, power modules and even complete stack solutions.



Latest Innovations

600V_TRENCHSTOP_TO-247_vA_plain  

New TRENCHSTOP™ Performance IGBT

The new TRENCHSTOP™ Performance discrete IGBT (60TP) is the new higher efficiency and competitive price IGBT for applications working up to 30kHz in hard-switching topologies.

>Learn more

 

General description of our IGBT portfolio

IGBT bare dies are silicon based IGBT chips. Infineon supports bare die and wafer solutions for module manufacturers enabling higher levels of integration, power density and board space reduction. Furthermore, Infineon offers a broad portfolio of IGBT chips assembled in discrete plastic packages, so called Discretes IGBTs, which are available as Single IGBTs and co-packed with freewheeling Diode. This devices are suitable for applications such as General Purpose Inverters, Solar Inverters, UPS, Induction Heating, Major Home Appliances, Welding and SMPS. Benefits of Discretes IGBT are high current density and low power dissipation resulting in higher efficiency and smaller heat sink to allow lower overall system cost.

Larger arrangements that form basic building blocks of power electronic equipment are considered Power Modules usually combining IGBT and diode dies in various topologies. Ready-to-use assembled stacks are configured to cope with the needs of highest power applications. These stacks, often referred to as Systems, are built on IGBT power modules or discs, depending on the field of application. From all-in-one power integrated modules with rectifier, brake chopper and inverter part to highest power Stack assemblies, Infineon products cover a range from only hundreds of watts to several megawatts. General purpose drives, servo-units and renewable energy applications like solar inverters or wind applications benefit from the outstanding performance, efficiency and longevity of these highly reliable products.

The HybridPACK™ family as a special product series with automotive qualification is available to support the designer's efforts in electric mobility. Infineon further supports the automotive industry, providing a variety of discrete IGBT power semiconductors qualified according to AECQ101.

To ease setting up a laboratory experiment or a first prototype, Infineon helps by providing evaluation boards for most of the products to accelerate development cycles. Thus, conclusive results can be generated within the shortest possible time.

 

Highpower Thyristors & Diodes   EiceDRIVER™   MIPAQ™ Pro

Shortform Catalog

 

Banner_Selection-Guide

 

IPOSIM - Power Simulation

 

PowerGuru


IGBT


Product_image_Mipaq_pro  

 

 

MIPAQ™ Pro

MIPAQ™ Pro intelligent power module (IPM) is a fully qualified and tested IPM integrating IGBTs, gate drivers, a heat sink, sensors, digital control electronics as well as digital bus communication. It comes in a half-bridge configuration with blocking voltages of 1200 V and 1700 V. Discover a new Dimension of Smart Protection

 


Product_image_xhp  

 

 

XHP™ - FleXible High-Power Platform

The new housing for high-power IGBT modules is designed to cover the full-voltage range of IGBT chips from 3.3 to 6.5 kV. Principle applications of the new package are expected in industrial drives, traction, renewable energy and power transmission applications. Discover more about our XHP

 


Product image PrimePACKIGBT5.XT  

PrimePACK™ with IGBT5 and .XT

The innovative technologies IGBT5 and .XT will at first extend the well-known PrimePACK™ portfolio. With these new technologies the power density can be increased by 25% or the life time can be extended by a factor 10. More about our PrimePACK TM Modules with IGBT5 and .XT

 


PrimePACK™ with TIM  

 

Thermal Interface Material (TIM)

TIM is the abbreviation for Infineon`s new Thermal Interface Material. With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. Further information, such as articles, editorials and application notes are available.

 


SmartPIM 2  

 

 

 

Smart Power Modules

This module family provides all reliability characteristics known from the established PressFIT technology and comes up with advanced features. The complete housing family will follow the same mounting process and cover a possible current range up to 200 A distributed over the different housing sizes. Read more about our Smart Power Modules

 

 

 


Product image Easy 2B - Pressfit - blank  

Modules for Photo-voltaic String and Multi-String Inverters

Tailor-made modules for photo-voltaic string and multi-string inverters. Optimised inverter efficiency and performance can be achieved. Fast and solder-less assembly is possible using the proven PressFIT technology. Read more about our modules for Photo-voltaic String and Multi-String Inverters

 

Silicon Carbide (SiC)

Power modules available with Silicon Carbide (SiC) diodes and transistors. These key components for modern and innovative power electronic solutions aim for the highest power density and efficiency. Those targets can be achieved by using the chips as stand-alone components or in combination with silicon power devices in power modules. Find out more about our SiC Modules

 

SiC-icon

 


Product image 2ED300C17-S_2  

 

 

 

EiceDRIVER™ - Gate Driver ICs and Boards

Highly reliable solutions for driving MOSFETs, IGBTs and IGBT modules which enable our customers to build reliable and efficient applications. Discover our broad spectrum of optimized low and high voltage gate driver ICs and boards

 


Product image 2ED020I12FA  

 

 

Automotive EiceDRIVER™

The Infineon EiceDRIVER™ family includes single and dual channel automotive IGBT Driver IC’s providing galvanic isolation and bidirectional signal transmission with high ambient temperature capability. Find out more about our Automotive EiceDRIVER™

 


Product image P-IG-IHM_B ifx  

IHM / IHV IGBT modules B-series

The well known IHM (IGBT High-Power Modules) & IHV (IGBT High-Voltage Modules) are robust and work with supreme reliability at any temperature condition from -40/-50°C up to +150°C. IHM-B/IHV-B are offered in a range of 500 A to 3600 A at 1200 V to 4,5 kV, which enables them through different topologies (half-bridge-, single switch-, chopper- and diode modules) to be used in various high power inverter sizes. Read more about our IHM / IHV IGBT modules B-series

 

3.3 kV modules in IHV housing

The IHM/IHV product group covers all possible inverter power sizes as single switch, half-bridge-, chopper and diode modules. More about our 3.3 kV modules in IHV portfolio

 


Product image P-IG-IHV-H_IH12 ifx  

4.5kV Modules in IHV housing

The 4,5 kV trench plus Field stop IGBT and Field stop diode chips fill the gap between the voltage classes of 3.3 kV and 6.5 kV IGBT modules. More about our 4.5 kV modules

 

6.5 kV Modules in IHV housing

New RCDC technology introduced to address customers’ demand of high power density, efficiency, long lifecycle, reliability, improved temperature behavior and reduced systems costs in high voltage applications. It combines IGBT and diode function in one chip. IHV housing established a standard for high power IGBT modules which was used in countless applications all over the world. Read more about our 6.5 kV IGBT modules

 


Product image 34mm  

 

 

34 mm & 62 mm IGBT Modules

Flexibility, optimal electrical performance and highest reliability. These are the keywords for a successful inverter layout. The 34 mm and 62 mm product family of Half Bridges and Single Switches with the state-of-the-art IGBT4 Chip Technology perfectly fits into modern inverter concepts for all kinds of applications. Our well-known 34 and 62 mm modules are the right choice for your design.

 


Product image EconoPACK +_OEx  

 

 

EconoPACK™+ D-series

The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts provide also the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected molded control and power terminals and ultrasonic welded power terminals. Make the next step with the EconoPACK™+ D-series

 


Product image EconoPACK 4  

 

EconoPIM™/ EconoPACK™ 650V IGBT 4

The new 650V IGBT4-E4 is an optimized chip version designed with respect to the application needs. The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort. Read more about our EconoPIM™/ EconoPACK™ 650V IGBT 4

 

EconoPACK™ 4 IGBT Modules

The EconoPACK™ 4 package perfectly fits into the well-known Econo portfolio. EconoPACK™ 4 features screw power terminal, providing excellent electric connection. DC and AC link are separated and distinguishable at one glance for ease of use. More about our EconoPACK™ 4 IGBT Modules

 


Product image EconoDUAL 3  

 

 

EconoDUAL™ 3 650V/ 1200V/ 1700V 600A

Infineon offers the well-established EconoDUAL™ 3 series. Our contribution to your success are new advanced assembly technologies, superb thermal performances to enable full power utilization, Plug and play upgrades of existing inverter designs and PressFIT and solder pin versions. Best in class: EconoDUAL 3 650V/ 1200V/ 1700V 600A

 


IGBT

Application Notes

Title Size Date Version
724 KB 09 Apr 2009
97 KB 19 Jun 2010
3.8 MB 17 Oct 2012
307 KB 09 Apr 2009
1.1 MB 09 Apr 2009
121 KB 27 Oct 2004
125 KB 27 Oct 2004
89 KB 09 Dec 2003
425 KB 27 Oct 2004
164 KB 27 Oct 2004
738 KB 17 Dec 2015 01_00
728 KB 05 Aug 2014
1.2 MB 13 Nov 2015 01_00
167 KB 19 Jun 2010
625 KB 19 Jun 2010
281 KB 27 Oct 2004
428 KB 09 Apr 2009
887 KB 07 Aug 2012
794 KB 30 Sep 2013
426 KB 22 Jan 2013
1.6 MB 01 Oct 2015 01_00
370 KB 27 Oct 2004
252 KB 27 Oct 2004
283 KB 27 Oct 2004
176 KB 18 Jun 2001
206 KB 13 Aug 2013
2.3 MB 12 Nov 2012
574 KB 27 Oct 2004
1.4 MB 19 Jun 2004
194 KB 09 Apr 2009
84 KB 09 Apr 2009
337 KB 27 Oct 2004
1.1 MB 27 Oct 2004
1.1 MB 04 Nov 2014 01_00
39 KB 27 Oct 2004
190 KB 16 Feb 2007
983 KB 29 Nov 2013

Product Selection Guide

Title Size Date Version
4.7 MB 22 Feb 2016 00_00
343 KB 06 Apr 2016 00_01
2.7 MB 12 Mar 2008
989 KB 12 Apr 2016 00_00
3.8 MB 12 Mar 2008
3.8 MB 12 Mar 2008

Product Brief

Title Size Date Version
446 KB 27 Jan 2015 01_00
278 KB 14 Jul 2014 01_00
302 KB 28 Apr 2014
283 KB 27 Apr 2016 02_00
188 KB 27 Apr 2016 02_00
197 KB 27 Apr 2016 07_00
165 KB 27 Apr 2016 07_00
440 KB 27 Apr 2016 07_00
239 KB 27 Apr 2016 02_00
454 KB 04 Jun 2013
248 KB 09 May 2016 01_00
307 KB 27 Apr 2016 08_00
410 KB 27 Apr 2016 04_00
194 KB 27 Apr 2016 07_00
452 KB 27 Apr 2016 08_00
246 KB 07 Aug 2012 01_00
1,017 KB 29 Jan 2008
179 KB 07 Feb 2014
74 KB 13 May 2014 01_00
501 KB 18 Oct 2012
322 KB 25 Apr 2016 01_00
168 KB 27 Apr 2016 06_00
212 KB 27 Apr 2016 02_00
690 KB 20 Oct 2011
476 KB 27 Apr 2016 04_00

Additional Product Information

Title Size Date Version
478 KB 27 Apr 2016 01_00
134 KB 28 Jan 2016 01_00

Article

Title Size Date Version
536 KB 10 Dec 2014 01_00
165 KB 03 Aug 2006
375 KB 16 Nov 2012
1.6 MB 13 Aug 2014
150 KB 16 Mar 2006
3.3 MB 15 Aug 2003
510 KB 03 Aug 2006
71 KB 16 Mar 2006
1.9 MB 18 Jun 2001
432 KB 01 Oct 2014
147 KB 16 Mar 2006
231 KB 14 May 2014
134 KB 16 Mar 2006
708 KB 10 Dec 2014 01_00
204 KB 03 Aug 2006
87 KB 03 Aug 2006
57 KB 03 Aug 2006
391 KB 16 Mar 2006
359 KB 10 Dec 2014 01_00
215 KB 03 Aug 2006
317 KB 03 Aug 2006
129 KB 03 Aug 2006
387 KB 16 Mar 2006
688 KB 01 Feb 2007

Product Brochure

Title Size Date Version
216 KB 09 May 2016 01_00
1.3 MB 27 Apr 2016 08_00
613 KB 27 Apr 2016 03_00
2.1 MB 09 May 2016 01_00
401 KB 27 Apr 2016 09_00

Editorials

Title Size Date Version
521 KB 04 Nov 2015 01_00
908 KB 04 Nov 2015 01_00
349 KB 04 Nov 2015 01_00
698 KB 04 Nov 2015 01_00
297 KB 04 Nov 2015 01_00
386 KB 04 Nov 2015 01_00
344 KB 04 Nov 2015 01_00

Application Brochure

Title Size Date Version
340 KB 23 Oct 2015 01_00
409 KB 28 Jan 2016 01_00
1.5 MB 27 Apr 2016 08_00
2.4 MB 27 Apr 2016 09_00
4.4 MB 24 May 2016 01_00
2.6 MB 27 Apr 2016 08_00

Product Family Overview

Title Size Date Version
856 KB 09 Nov 2012
1.3 MB 18 Feb 2014
501 KB 10 May 2010

Product Catalogue

Title Size Date Version
4.4 MB 09 May 2016 01_00

IGBT

Evaluation Boards

Board Family Description Status
2ED300E17-SFO Gate Driver, IGBT Modules This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.
  • For equipping EiceDRIVER™ 2ED300C17-S / -ST
on request
7ED020E12-FI-U1 IGBT Modules Evaluation Driver Board for SmartPIM 1 Modules up to 1200V. Coreless transformer half-bridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 2ED020I12-FI
  • For driving SmartPIM 1 Modules
on request
7ED020E12-FI-W2 IGBT Modules Evaluation Driver Board for EasyPIM™ 2B PressFIT Modules up to 1200V. Coreless transformer halfbridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 2ED020I12-FI
  • For driving EasyPIM™ 2B PressFIT Modules
on request
EASYKIT AUX DRIVES IGBT Modules DC/AC inverter system Evaluation Kit for the FS50R07W1E3_B11A Easy Automotive Power Modules.
  • CAN Transceiver TLE8250
  • Diodes BAS3010, BAS16
  • Driver IC 2ED020I12
  • Including: IGBT Module FS50R07W1E3
  • MOSFETs BSO604, BSS670
  • Microcontroller SAK-XC2768X-136F128L AA
  • Transistor BCW66, BCW67, BC847
  • Voltage Regulator TLE7274
on request
EASYKIT DCDC IGBT Modules DC/DC converter system Evaluation Kit for the F4-50R07W1H3_B11A EasyPACK 1B Automotive Power Modules.
  • Diodes BAS3010, BAT64, BAS16, SMBD914
  • Driver IC 1ED020I12, 2ED020I12
  • Including: IGBT Module F4-50R07W1H3
  • MOSFETs IPB180N08, BSO604
  • Transistor BC817
  • Voltage Regulator TLE7274
on request
EVAL-1ED020I12-B2 Gate Driver, IGBT Modules Evaluation Board for 1ED020I12-B2 - Galvanic isolated single channel IGBT driver IC with CT technology for 600V/1200V IGBTs.
  • Driving IGBTs
  • For equipping 1ED 1200V single channel EiceDRIVER™
active and preferred
EVAL-1ED020I12-BT Gate Driver, IGBT Discrete Evaluation Board for 1ED020I12-BT - Galvanic isolated single channel IGBT driver IC with CT technology for 600V/1200V IGBTs.
  • Driving IGBTs
  • For equipping 1ED 1200V single channel EiceDRIVER™
active and preferred
EVAL-1EDI60I12AF Gate Driver, IGBT Discrete, MOSFET Evaluation Board for 1EDI60I12AF – two 1200V single channel coreless transformer isolated gate driver IC in half bridge configuration for MOS-transistors or IGBTs.
  • Driving MOS-transistors or IGBTs
  • For equipping 1EDI 1200V single channel EiceDRIVER™
active and preferred
EVAL-2ED020I12-F2 Gate Driver, IGBT Discrete Evaluation Board for 2ED020I12-F2 - Galvanic isolated dual channel IGBT driver IC with CT technology for 600V/1200V IGBTs.
  • Driving IGBTs
  • For equipping 2ED020I12-F2 EiceDRIVER™
active and preferred
EVAL-2EDL05I06PF Gate Driver, IGBT Discrete, MOSFET Evaluation Board for 2EDL05I06PF - Optimized 600V half bridge gate driver IC with LS-SOI technology to control power devices like MOS-transistors or IGBTs.
  • Driving IGBT Modules
  • For equipping 1ED 1200V single channel EiceDRIVER™
active and preferred
EVAL-2EDL23I06PJ Gate Driver, IGBT Discrete Evaluation Board for 2EDL23I06PJ - Optimized 600V half bridge gate driver IC with LS-SOI technology to control THT Highspeed3-IGBT IKP20N60H3 in TO220 package.
  • Driving IKP20N60H3
  • For equipping 2EDL23I06PJ EiceDRIVER™
active and preferred
EVAL-6EDL04I06PT Gate Driver, IGBT Discrete Evaluation Board for 6EDL04I06PT - Full bridge 3 Phase gate driver IC with LS-SOI technology to control power devices like MOS-transistors or 600V IGBTs
  • Driving RCD-IGBTs
  • For equipping 6EDL04N02PR EiceDRIVER™
active and preferred
F3L030E07-F-W2 IGBT Modules Evaluation Driver board for 650V Easy2B 3-level modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 1ED020I12-F2
  • For driving Easy2B 3-level Modules
on request
HYBRID KIT1 PIN-FIN IGBT Modules Evaluation Kit including HybridPACK™ 1 Pin-Fin power module, driverboard with coreless transformer isolated driver (1ED020I12- FA) and logic board
  • CAN Transceiver TLE6250
  • DC/DC Converter TLE8366EV, TLE7368
  • Diodes BAS16, BAT54-04W
  • Driver IC 1ED020I12FA2
  • Including: IGBT Module FS400R07A2E3_H5
  • MOSFETs IPD90P03P4L-04, IPD144N06NG, BSS138N
  • Microcontroller SAK-TC1767
  • Transistor BCR183S, BCR10PN, BDP949
  • Voltage Regulator TLE4296-2GV50, TLE4266
on request
HYBRID KIT1+ IGBT Modules Evaluation Kit including HybridPACK™ 1 power module, driverboard with coreless transformer isolated driver (1ED020I12- FA) and logic board
  • CAN Transceiver TLE6250
  • DC/DC Converter TLE8366EV, TLE7368
  • Diodes: BAS16, BAT54-04W
  • Driver IC 1ED020I12FA2
  • Including: IGBT Module FS400R07A1E3
  • MOSFETs: IPD90P03P4L-04, IPD144N06NG, BSS138N
  • Microcontroller SAK-TC1767-256F133HL
  • Transitor: BCR183S, BCR10PN, BDP949
  • Voltage Regulator TLE4266, TLE4296-2GV50
on request
2ED100E12-F2 IGBT Modules Evaluation Driver Board for EconoDUAL™3 Modules using a coreless transformer single-channel driver (replaced by the EiceDRIVER™ 1ED020I12-F2)
  • Equipped with EiceDRIVER™ 1ED020I12-F
  • For driving EconoDUAL™3
on request
6ED100E12-F2 IGBT Modules Evaluation Driver board for EconoPACK™+ IGBT modules, using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).
  • Equipped with EiceDRIVER™ 1ED020I12-F
  • For driving EconoPACK™+ IGBT Modules
on request
F3L020E07-F-P IGBT Modules Evaluation Driver board for 650V 3-level EconoPACK™ 4 modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 1ED020I12-F2
  • For driving 650V EconoPACK™ 4 3-level IGBT Modules (NPC1)
on request
F3L2020E07-F-P IGBT Modules Evaluation Driver board for 650V 3-level EconoPACK™ 4 modules in NPC2-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 1ED020I12-F2
  • For driving 650V 3-level EconoPACK™ 4 modules (NPC2)
on request
MA070E17 IGBT Modules Evaluation Adapter board with booster stage for 62mm modules up to 1700V.
  • For connecting 1700V 62mm Modules and driver boards
on request
MA200E12 IGBT Modules Evaluation Adapter board with booster stage for 1200V EconoDUAL™ 3 modules.
  • For connecting 1200V EconoDUAL™ 3 Modules and driver boards
on request
MA200E17 IGBT Modules Evaluation Adapter board with booster stage for 1700V EconoDUAL™ 3 modules.
  • For connecting 1700V EconoDUAL™ 3 Modules and driver boards
on request
MA3L080E07 IGBT Modules Evaluation Adapter Board with booster stage for EconoPACK™ 4 3-Level Modules in NPC1-Topology (650V)
  • For connecting 650V EconoPACK™ 4 IGBT Modules (NPC1) and Driver boards
on request
MA3L120E07 IGBT Modules Evaluation Adapter Board with booster stage for EconoPACK™ 4 3-Level Modules in NPC2-Topology (650V)
  • For connecting 650V EconoPACK™ 4 IGBT Modules (NPC2) and Driver boards
on request
MA400E12 IGBT Modules Adapter board with booster stage for 1200V IHM modules (130mm x 140mm). The IGBT module is to be ordered separately.
  • For connecting 1200V IHM IGBT Modules and driver boards
on request
MA400E17 IGBT Modules Evaluation Adapter board with booster stage for IHM modules up to 1700V (130mm x 140mm).
  • For connecting 1700V IHM IGBT Modules and driver boards
on request
MA401E12 IGBT Modules Evaluation Adapter Board with booster stage for IHM IGBT Modules up to 1200V (140mm x 190mm).
  • For connecting 1200V IHM IGBT Modules and driver boards
on request
MA401E17 IGBT Modules Evaluation Adapter Board with booster stage for IHM IGBT Modules up to 1700V (140mm x 190mm).
  • For connecting 1700V IHM IGBT Modules and driver boards
on request
MA3L120E12_EVAL IGBT Modules Evaluation Adapter board with booster stage for 1200V EconoPACK™ 4 3-Level Modules in NPC2-Topology.
  • For connecting 1200V EconoPACK™ 4 IGBT Modules (NPC2) and Driver boards
on request
F3L2020E12-F-P_EVAL Gate Driver, IGBT Modules Evaluation Driver board for 1200V EconoPACK™ 4 3-Level Modules in NPC2-Topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.
  • Equipped with EiceDRIVER™ 1ED020I12-F2
  • For driving 1200V 3-level EconoPACK™ 4 modules (NPC2)
on request
2ED300C17-S IGBT Modules up to 1700V EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolation
  • For driving IGBT modules up to 1700V
active and preferred
2ED300C17-ST IGBT Modules up to 1700V EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolation
  • For driving IGBT modules up to 1700V
active and preferred
HYBRID KIT2 ENH SIL IGBT Modules Evaluation Kit including HybridPACK™ 2 Enhanced power module and driverboard with EiceDRIVER™ SIL 1EDI2002AS, EiceDRIVER™ Boost 1EBN1001AE and AURIX™ 32-bit multicore microcontroller TC277
  • AURIX™ 32-bit multicore microcontroller TC277
  • EiceDRIVER™ Boost 1EBN1001AE
  • EiceDRIVER™ SIL 1EDI2002AS
  • HybridPACK™ 2 Enhanced FS800R07A2E3_B31
on request
MA070E12 IGBT Modules Evaluation Adapter board with booster stage for 62mm modules up to 1200V.
  • For connecting 1200V 62mm Modules and driver boards
on request
MA300E17 IGBT Modules Evaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration.
  • For connecting 1700V PrimePACK™ IGBT Modules and driver boards
on request
MA300E12 IGBT Modules Evaluation Adapter board containing a booster stage for driving 1200V PrimePACK™ in single or parallel configuration.
  • For connecting 1200V PrimePACK™ IGBT Modules and driver boards
on request
2ED250E12-F IGBT Modules Evaluation Driver Board for PrimePACK™ Modules up to 1200V using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).
  • Equipped with EiceDRIVER™ 1ED020I12-F
  • For driving PrimePACK™ IGBT Modules
on request
EVAL-IGBT-650V-TO247-4 IGBT Discrete Adaptable double pulse tester for IGBTs in TO-247 4pin package
    active and preferred
    IRMDG62-1-D2
    • IRGS4610DPBF
    active

    IGBT

    Simulation Models

    Title Size Date Version
    6 KB 11 Jul 2013 01_00
    7 KB 11 Jul 2013 03_00
    8 KB 11 Jul 2013 03_01
    8 KB 16 Jul 2013 01_00
    5 KB 11 Jul 2013 03_05
    9 KB 11 Jul 2013
    14 KB 22 Jun 2012
    4 KB 11 Jul 2013 02_06
    6 KB 11 Jul 2013 01_00
    5 KB 11 Jul 2013 02_06
    8 KB 11 Jul 2013 01_00
    4 KB 11 Jul 2013 01_00
    10 KB 11 Jul 2013 01_00
    7 KB 17 Jun 2014
    7 KB 11 Jul 2013 03_00
    6 KB 12 Aug 2014 05_00
    3 KB 26 Jul 2007 01_00
    3.4 MB 18 Mar 2014
    4 KB 11 Jul 2013 02_06
    9 KB 03 Jan 2013
    7 KB 11 Jul 2013 00_05
    6 KB 11 Jul 2013 03_00
    9 KB 11 Jul 2013 03_00
    9 KB 09 Oct 2015 01_00
    14 KB 03 Jan 2013

    IGBT

    trenchstop-performance-elearning

    eLearning 600V TRENCHSTOP™ Performance IGBT

    Infineon's new TRENCHSTOP™ Performance (60TP) IGBT is the new higher efficiency and competitive price IGBT for applications working up to 30kHz in hard-switching topologies

     
    Length 2:42

     

    Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

    TRENCHSTOP™ 5 Soft Hard Switching “S5” Introduction

    Brief introduction into the key values and customer benefits of the new TRENCHSTOP™ S5 Family

     
    Length 2:42

     

    XHP™ - Infineon´s new flexible high power platform

    XHP™ - Infineon´s new flexible high power platform

    Get an first impression how XHP™ will boost your system. This video explain how you can reach the next level of flexibility with Infineon´s new high power platform.

     
    Length 4:36

     

    Thermal Interface Material

    Thermal Interface Material

    A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

     
    Length 1:48

     

    EiceDRIVER™ 2EDL Driver IC Family

    EiceDRIVER™ 2EDL Driver IC Family

    EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 

     
    Length 9:21

     

    TRENCHSTOP™ 5 - Portfolio and Summary

    TRENCHSTOP™ 5 - Portfolio and Summary

    The new 650V TRENCHSTOP™5 IGBT technology from Infineon redefines the “Best-in-Class IGBT” by providing unmatched performance in terms of efficiency. When high efficiency, lower system costs and increased reliability are demanded, 650V TRENCHSTOP™5 is the only option. The new TRENCHSTOP™5 IGBTs deliver a dramatic reduction in switching and conduction losses for PFC and PWM topologies in applications such as Welding, Uninterruptible Power Supply and Solar. 650V TRENCHSTOPTM5 is available in two variants, HighSpeed 5 (H5) for high speed and HighSpeed5 Fast (F5) for highest efficiency.

     
    Length 2:39

     

    Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

    Low VCE(sat) Optimized TRENCHSTOP™ 5 L5

    The TRENCHSTOP™ 5 family L5 with low saturation voltage VCE(sat) is optimized for polarity switches at switching frequencies of 50kHz-20kHz. The intrinsically low conduction losses of the 55µm TRENCHSTOP™ 5 thin wafer technology have been reduced further with additional optimization of the carrier profile.

     
    Length 2:42

     

    Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

    Discrete IGBT in TO-247PLUS - Technical Discription and Performance Part1

    TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector 

     
    Length 3:22

     

    TRENCHSTOP™ 5 IGBTs in Kelvine Emitter Configuration - Benefits of TRENCHSTOP™ 5 in TO-247 4pin

    TRENCHSTOP™ 5 IGBTs in Kelvine Emitter Configuration - Benefits of TRENCHSTOP™ 5 in TO-247 4pin

    This video will provide you information about the best in class performance of the TRENCHSTOP™5 IGBT technology. Infineon offers the technology in a high power package with an extra Kelvin Emitter pin. 

     
    Length 2:06

     

    RC-H5 The Next Generation Reverse Conduction IGBT Part 1 of 2

    RC-H5 The Next Generation Reverse Conduction IGBT Part 1 of 2

    The latest generation of reverse conducting IGBTs has been optimized for the demanding requirements of Induction Cooking applications. RC-H5 offers up to 30% reduction in switching losses, allowing designers to use higher frequencies.

     
    Length 9:21

     

    PressFit Technology

    PressFit Technology

    Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

     
    Length 3:00

     

    Infineon’s New 4.5kV IHV IGBT

    Infineon’s New 4.5kV IHV IGBT

    The new 4.5kV IGBT modules are optimized for use in traction drives and high-voltage DC transmission systems.

     
    Length 4:19

     

    Power Conversion EN

    Power Conversion EN

    Infineon provides a comprehensive portfolio of high-power products for Power Conversion, to help its customers to achieve their aims. These high-performance products boost the reliability and efficiency of inverters for photovoltaic or wind applications.

     
    Length 2:02

     

    Advanced Transmission & Distribution EN

    Advanced Transmission & Distribution EN

    Thyristors have dominated this application for many decades. Nowadays thyristors as well as IGBTs are used in HVDC systems and FACTS to fulfill different needs.

     
    Length 1:39

     

    Storing solar energy at home

    Storing solar energy at home

    New technology from Infineon promotes the adoption of renewables by enabling solar energy to be stored efficiently

     
    Length 8:05

     

    Renewable energy from offshore wind farms

    Renewable energy from offshore wind farms

    Energy means life: It heats houses, powers cars and lights megacities. The global appetite for energy is voracious, while resources are dwindling. One third of the energy consumed worldwide is electricity and the trend is rising. The name of the key energy source of the future is energy efficiency. Optimal electricity use is achieved by harnessing smart semiconductor technology: Innovative chip solutions fine-tune cars, industrial plants, consumer and household electronics to use less energy.

     
    Length 7:32

     

    IGBT

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