Infineon’s new Thermal Interface Material (TIM)

With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available. TIM not only provides the lowest thermal resistance, it also fulfills the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability. TIM has been developed to fit to most of our existing power module packages as well as to upcoming future designs. Using modules with preapplied TIM will achieve a reproducible thermal performance of power electronic applications.