TO-leadless (TOLL)

High current capability (up to 300 A) with substantial footprint reduction

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Overview

OptiMOS™ MOSFETs in TO-Leadless (TOLL) package offers the industry's lowest on-state resistance together with high current capability. This enables a reduction in the number of paralleled MOSFETs in high-power applications and increases the power density. Additionally, 60 percent board space reduction is achievable compared to D2PAK 7-pin package.

Key Features

  • High current capability up to 300 A
  • Reduced electromigration
  • Very low package parasitics
  • Enabling very compact design
  • Highest system reliability
  • Low EMI

Products

About

Designed for applications demanding high current and high temperature

Infineon’s OptiMOS™ power MOSFETs in TO-Leadless package are optimized for high-current applications up to 300 A, such as, forklifts, light electric vehicles (LEV), power tools, point-of-load (POL), telecom, and e-fuses. Furthermore, the 60 percent smaller package size enables a very compact design. Compared to D²PAK 7-pin, TO-Leadless shows a substantial reduction in footprint of 30 percent. The 50 percent reduced height offers a significant advantage in narrow applications such as rack or blade servers.

Innovative TOLL package MOSFETs with OptiMOS™ technology

TO-Leadless is a molded package optimized for high-power and high-reliability applications. Its small mechanical dimensions allow compact designs. The high current capability combined with the low thermal resistance (RthJC) result in lower chip temperatures, enabling higher power density and reliability. TO-Leadless is a package without leads with the possibility of optical inspection due to tin-plated, grooved gate, and source contacts.

TOLL: the solution to electro-migration challenges

TO-Leadless is the ideal package solution for the electro-migration challenge in high-power and high-temperature applications. A 50 percent larger solder contact area avoids electro-migration, leading to improvement in reliability. Infineon offers nine voltage classes for OptiMOS™ power MOSFETs in TO-Leadless packaging ranging from 30 V to 250 V.

Designed for applications demanding high current and high temperature

Infineon’s OptiMOS™ power MOSFETs in TO-Leadless package are optimized for high-current applications up to 300 A, such as, forklifts, light electric vehicles (LEV), power tools, point-of-load (POL), telecom, and e-fuses. Furthermore, the 60 percent smaller package size enables a very compact design. Compared to D²PAK 7-pin, TO-Leadless shows a substantial reduction in footprint of 30 percent. The 50 percent reduced height offers a significant advantage in narrow applications such as rack or blade servers.

Innovative TOLL package MOSFETs with OptiMOS™ technology

TO-Leadless is a molded package optimized for high-power and high-reliability applications. Its small mechanical dimensions allow compact designs. The high current capability combined with the low thermal resistance (RthJC) result in lower chip temperatures, enabling higher power density and reliability. TO-Leadless is a package without leads with the possibility of optical inspection due to tin-plated, grooved gate, and source contacts.

TOLL: the solution to electro-migration challenges

TO-Leadless is the ideal package solution for the electro-migration challenge in high-power and high-temperature applications. A 50 percent larger solder contact area avoids electro-migration, leading to improvement in reliability. Infineon offers nine voltage classes for OptiMOS™ power MOSFETs in TO-Leadless packaging ranging from 30 V to 250 V.

Documents

Documents

Design resources

Developer community

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