SOT-223

CoolMOS™ superjunction MOSFETs in SOT-223 packages

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Overview

Cost-effective DPAK drop-in replacement for consumer applications. Infineon provides the first complete high-voltage MOSFET portfolio in a SOT-223 package worldwide to reduce the overall bill of material (BOM) while maintaining full compatibility to a DPAK footprint. The SOT-223 package is available with the latest CoolMOS™ superjunction technologies tailored for consumer applications.

Key Features

  • DPAK compatible footprint
  • Lowest package cost
  • Reduces size and thickness
  • Rthjc 17-21 K/W

Products

About

CoolMOS™ superjunction MOSFETs in SOT-223 package

Infineon has revolutionized the MOSFET game with the CoolMOS™ superjunction technology, now available in a SOT-223 package. 

This cost-effective DPAK drop-in replacement is perfect for consumer applications and will significantly reduce your bill of material (BOM). 

Infineon's high-voltage MOSFET portfolio offers full compatibility to a DPAK footprint while providing superior performance.

The world's first high-voltage MOSFET portfolio in a SOT-223 footprint

Infineon has made it easier and more cost-effective than ever before to reduce the overall BOM for consumer applications with the introduction of the first complete high-voltage MOSFET portfolio in a SOT-223 package. The CoolMOS™ superjunction technologies fit directly into a DPAK footprint, providing the next level in efficient power conversion and improved power density.

Cost-effective SOT-223 CoolMOS™ MOSFETs provide superior performance

Utilizing Infineon's cost-effective SOT-223, CoolMOS™ MOSFETs allow for superior performance in high-voltage and denser high-ohmic applications, compared to DPAK solutions. This is due to their smallest geometry per RDS(on) (drain-source on resistance) and reduced overall BOM costs. As a result of this shift, users benefit from smaller package dimensions, an improved footprint, and greater efficiency. Furthermore, the SOT-223 package offers no thermal limitations when plugging into the compatible DPAK footprint, making it the most effective solution for these applications.

CoolMOS™ superjunction MOSFETs in SOT-223 package

Infineon has revolutionized the MOSFET game with the CoolMOS™ superjunction technology, now available in a SOT-223 package. 

This cost-effective DPAK drop-in replacement is perfect for consumer applications and will significantly reduce your bill of material (BOM). 

Infineon's high-voltage MOSFET portfolio offers full compatibility to a DPAK footprint while providing superior performance.

The world's first high-voltage MOSFET portfolio in a SOT-223 footprint

Infineon has made it easier and more cost-effective than ever before to reduce the overall BOM for consumer applications with the introduction of the first complete high-voltage MOSFET portfolio in a SOT-223 package. The CoolMOS™ superjunction technologies fit directly into a DPAK footprint, providing the next level in efficient power conversion and improved power density.

Cost-effective SOT-223 CoolMOS™ MOSFETs provide superior performance

Utilizing Infineon's cost-effective SOT-223, CoolMOS™ MOSFETs allow for superior performance in high-voltage and denser high-ohmic applications, compared to DPAK solutions. This is due to their smallest geometry per RDS(on) (drain-source on resistance) and reduced overall BOM costs. As a result of this shift, users benefit from smaller package dimensions, an improved footprint, and greater efficiency. Furthermore, the SOT-223 package offers no thermal limitations when plugging into the compatible DPAK footprint, making it the most effective solution for these applications.

Documents

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }