IAUCN04S7N024D
Active and preferred
RoHS Compliant

IAUCN04S7N024D

40 V, N-Ch, 2.49 mΩ max, Automotive MOSFET, Dual SSO8 (5x6), OptiMOS™ 7
Datasheet
package
ea.
in stock

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IAUCN04S7N024D
IAUCN04S7N024D
ea.
Datasheet

Product details

  • Country of Assembly (Last BE site, current, subject to change)
    Malaysia
  • Country of Diffusion (Last FE site, current, subject to change)
    Austria, Germany
  • ID (@25°C) max
    60 A
  • Launch year
    2024
  • Operating Temperature range
    -55 °C to 175 °C
  • Package
    PG-TDSON-8
  • Planned to be available until at least
    2038
  • Polarity
    N+N
  • QG (typ @10V)
    23 nC
  • QG (typ @10V) max
    30 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    2.49 mΩ
  • Technology
    OptiMOS™7
  • VDS max
    40 V
  • VGS(th) range
    2.2 V to 3 V
  • VGS(th)
    2.6 V
Recommended
OPN
IAUCN04S7N024DATMA1
Product Status active and preferred
Infineon Package
PG-TDSON-8
Package Name Dual SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TDSON-8
Package Name Dual SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The new automotive OptiMOS™7 40 V dual SSO8 MOSFET is offered in our reliable SSO8 5x6 mm² SMD package. It features two independent N-channel MOSFETs integrated in one package for PCB area savings. It is designed for high performance, high quality and the robustness needed for demanding and cost-efficient power automotive applications. The portfolio provides an RDS range from 1.94 mΩ to 5.59 mΩ combined with an increased current rating of 60 A.

Features

  • Small 5x6 mm2 footprint
  • High 60 A current capability
  • Leading-edge OptiMOS™7 40 V
  • RDS(on) range: 1.94mΩ to 5.59 mΩ
  • High avalanche capability
  • Leadless package with Cu-clip

Benefits

  • Highest power & current density
  • High thermal capacity package
  • Reduced conduction losses
  • Optimized switching behavior
  • Reduced form factor
  • JEDEC standard PG-TDSON-8

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