600V CoolSiC™ Generation 2
The second generation of Infineon SiC Schottky diodes has emerged over the years as the industry standard. The low V F values characterizing this family of products, make it particularly suitable for applications requiring high load efficiency. With the Generation 2 Infineon introduced a new design concept consisting in regularly distributed p-doped areas, in conjunction with the pure Schottky ones: the so-called "merged pn-structure" (MPS).
600V CoolSiC™ Generation 3
The third generation of Infineon SiC Schottky diodes features the industry’s lowest device capacitance for any given current rating, which further enhances overall system efficiency, especially at higher switching frequencies and under low load conditions. The Generation 3 is based on the same technology platform as Generation 2 with the introduction, at package level, of the so called diffusion soldering.