Active and preferred
RoHS Compliant
Lead-free

S25HL02GTDZBHM050

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S25HL02GTDZBHM050
S25HL02GTDZBHM050

Product details

OPN
S25HL02GTDZBHM050
Product Status active and preferred
Infineon Package
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S25HL02GTDZBHM050 is a 2 Gb SEMPER™ NOR Flash in an 8 × 8 mm, 24-ball BGA MCP (2 × 1 Gb die) for code and data storage. It runs from 2.7 V to 3.6 V over -40°C to +125°C and supports SPI/Dual/Quad and QPI modes up to 83 MBps DDR (83 MHz) or 133 MHz SDR. Built-in SECDED ECC, data integrity CRC, SafeBoot, and Endurance flex wear leveling plus 25-year retention target robust embedded/automotive designs.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • Multi-chip package: 2 × 1 Gb dies
  • Uniform or hybrid sector architecture
  • 256 or 512-byte program buffer
  • 1024-byte OTP secure silicon (SSR)
  • Quad SPI: 1-1-4, 1-4-4, 4-4-4
  • Quad SPI DDR read up to 102 MBps
  • ECC on 16-byte units, Hamming code
  • Corrects 1-bit, detects 2-bit errors
  • ECC status, trap address, counter
  • Endurance flex wear leveling regions
  • LBP + ASP sector/block protection

Benefits

  • Higher density lowers PCB footprint
  • Higher capacity in one BOM item
  • Aligns small params + bulk storage
  • Faster program cuts update time
  • Protect keys/IDs from cloning
  • Flexible host interface compatibility
  • Faster boot and code execute in place
  • ECC boosts read data reliability
  • Detects corruption before failure
  • Speeds debug and field diagnostics
  • Wear leveling extends flash lifetime
  • Prevents accidental erase or writes

Applications

Documents

Design resources

Developer community

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