P-MCC8-2-6
Active and preferred
RoHS Compliant

P-MCC8-2-6

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

P-MCC8-2-6
P-MCC8-2-6


Product details

  • Applications
    payment, transport ticketing, government identification
  • Contact Surface
    Ag
  • Delivery Forms
    Tape on Reel
  • Dimensions
    8.1 x 5.15mm
  • ISO – Reference
    ISO 7816-1, ISO 7810, ISO 10373-1/-3, ISO 14443
  • Pitch
    9.5 mm
  • Product Description
    standard contactless module, mold
  • Product Name
    P-MCC8-2-6
  • Thickness
    max. 340μm

Recommended
OPN
Product Status active and preferred
Infineon Package P-MCC8-2
Package Name N/A
Packing Size N/A
Packing Type N/A
Moisture Level N/A
Moisture Packing N/A
Lead-free No
Halogen Free Yes
RoHS Compliant Yes

Product Status
Active
Infineon Package P-MCC8-2
Package Name -
Packing Size 0
Packing Type
Moisture Level -
Moisture Packing
Lead Free
Halogen Free
RoHS Compliant
The P-MCC8-2-6 is an optimized contactless module that works as a 1:1 replacement for the existing MCC8-2-3/MOB4 modules: No change in thickness (shape and chip); No change in shape size (4.80 x 5.10 mm); Optimized for smaller ICs; Fully compatible with existing production equipment and settings. The Contactless Module MCC8-2-3 has been discontinued and is no longer available.

Features

  • 9.5mm
  • 8.1 x 5.15mm
  • max. 340μm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel

Applications

Documents

Design resources

Partner solutions

Developer community