IDSQ50G120C5D
NEW
Active and preferred
RoHS Compliant
Lead-free

IDSQ50G120C5D

NEW
CoolSiC™ 1200 V Schottky diode G5 in top side cooled Q-DPAK dual die-pad package
Datasheet
package

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IDSQ50G120C5D
IDSQ50G120C5D
Datasheet


Product details

  • I(FSM) max
    288 A
  • IF max
    167 A
  • IR
    26 µA
  • Package
    PG-HDSOP-16-U03
  • Ptot max
    789 W
  • QC
    223 nC
  • Qualification
    Industrial
  • RthJC max
    0.19 K/W
  • VF
    1.45 V

Recommended
OPN
IDSQ50G120C5DXUMA1
Product Status active and preferred
Infineon Package
PG-HDSOP-16
Package Name N/A
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 2
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
AT

Product Status
Active
Infineon Package
PG-HDSOP-16
Package Name -
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 2
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
AT
CoolSiC™ Schottky diode 1200 V, 50 A G5 in a top-side cooled Q-DPAK package for EV charging, commercial lighting, and power supplies. The Q-DPAK package enables lower system cost, simplified assembly, and excellent thermal performance. Combined with proven CoolSiC™ technology, the top-side cooled dual die-pad design delivers higher efficiency, increased power density, improved thermal management, and greater design flexibility.

Features

  • VRRM = 1200 V
  • IF = 50 A
  • No reverse recovery current
  • No forward recovery
  • High surge current capability
  • Temp. independent switching behavior
  • Low forward voltage
  • dv/dt ruggedness
  • Pb-free lead plating
  • RoHS compliant
  • .XT interconnection technology

Benefits

  • Higher power density
  • Enabling automated assembly
  • Less complex designs needed
  • Outstanding thermal performance vs BSC
  • Improve system power losses
  • Enable a VRMS of 950 V with PD 2
  • Lower BOM cost
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