Active and preferred
RoHS Compliant
Lead-free

FF600R12KE7P_E

1200 V, 600 A half-bridge IGBT module with pre-applied thermal interface material

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FF600R12KE7P_E
FF600R12KE7P_E

Product details

  • Configuration
    half-bridge
  • Dimensions (width)
    61.4 mm
  • Dimensions (length)
    106.4 mm
  • Features
    TIM
  • Housing
    62 mm
  • IC(nom) / IF(nom)
    600 A
  • IC max
    600 A
  • Qualification
    Industrial
  • Technology
    IGBT7 - E7
  • VCE(sat) (Tvj=25°C typ)
    1.5 V
  • VF (Tvj=25°C typ)
    1.8 V
  • Voltage Class max
    1200 V
OPN
FF600R12KE7PEHPSA1
Product Status active and preferred
Infineon Package AG-62MMHB
Package Name N/A
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-62MMHB
Package Name -
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
62 mm 1200 V, 600 A half-bridge IGBT module with TRENCHSTOP™ IGBT7 and emitter controlled diode.

Features

  • Highest power density
  • Best-in-class VCEsat
  • Tvj op = 175°C overload
  • High creepage & clearance distances
  • Isolated base plate
  • Standard housing
  • RoHS compliant
  • 4 kV AC 1 min insulation
  • Package with CTI > 400
  • UL/CSA certif. with UL1557 E83336

Benefits

  • higher current capability
  • for NPC2 in 3-level configuration
  • Highest power density
  • Avoidance of paralleling of IGBT modules
  • Reduced system costs
  • Highest reliability

Documents

Design resources

Developer community

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