Active and preferred
RoHS Compliant

FF2MR12W3M1H_B11

EasyDUAL™ 3B CoolSiC™ MOSFET half-bridge module 1200 V
Data Sheet
ea.
in stock

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FF2MR12W3M1H_B11
FF2MR12W3M1H_B11
ea.
Data Sheet

Product details

  • Applications
    UPS,Solar,Servo drives,Traction,ESS,CAV,FuelCell
  • Configuration
    Half-bridge
  • Dimensions (width)
    62 mm
  • Dimensions (length)
    109.85 mm
  • Features
    PressFIT
  • Housing
    Easy 3B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    1.44 mΩ
Recommended
OPN
FF2MR12W3M1HB11BPSA1
Product Status active and preferred
Infineon Package AG-EASY3B
Package Name N/A
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY3B
Package Name -
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyDUAL™ 3B 1200 V / 1.44 mΩ half-bridge module with CoolSiC™ MOSFET with enhanced generation 1, integrated NTC temperature sensor and PressFIT Contact Technology .

Features

  • Best-in-class package: 12 mm height
  • Easy module packages
  • Very low module stray inductance
  • Low and equal gate inductances
  • Symmetrical internal chip layouts
  • Wide RBSOA
  • 1200 V CoolSiC™ MOSFET
  • Gate drive vol.: +15…+18 V & 0…-5 V
  • Max. gate-source v.: +23 V & -10 V
  • Tvjop under overload condi. < 175°C
  • PressFIT pins

Documents

Documents

Design resources

Partner solutions

Developer community

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