- Low Switching Losses
- Low V CEsat
- Trench IGBT4
- V CEsat with positive Temperature Coefficient
- Al 2O 3 Substrate with Low Thermal Resistance
- Rugged Duplex frame construction
- Rugged selfacting PressFIT assembly
- Safe and simple mounting process
- Reduced assembly time
- Reliable connection of module Pins and PCB
- Flexible mounting possibilities
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