The demands on modern power electronics applications for industry, such as industrial drives, traction or renewables continue to rise. Harsh operating environments call for robust, low-maintenance designs. At the same time, cost pressures mandate standardized module designs capable of meeting application-specific requirements across a multitude of industries.
Traditionally, technological progress in power electronics has been driven and enabled by high-power semiconductors. The focus has typically been on optimizing chip technology rather than on package. However, as today’s modules and system requirements continue to evolve, current housing designs have reached their limits, highlighting the need for a new approach to packaging.
We have stepped up to this challenge and are proud to present the XHP™ family. This pioneering, high-power platform presents a modern solution for today’s cross-industry, cross-application demands for power density, efficiency, durability and robustness in two optimized housings. Designed for flexibility and reliability, these new housings will support future chip generations, too. Both the XHP™ 2 and 3 will have the same dimensions, giving product designers the opportunity to build homogenous solutions across different current and voltage ratings.