TOLL (TO-Leadless)

TO-Leadless is optimized to handle currents of up to 300 A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30 percent compared to D2PAK, together with a height reduction of 50 percent, results in an overall space saving of 60 percent enabling much more compact designs.

Footprint: 10x11x2.3 mm 

TOLG (TO-Leaded with gullwing)

TOLG package offers a compatible footprint to the TO-Leadless package with the additional feature of gullwing leads resulting in 2x higher TCoB performances compared to TO-Leadless. This package is excellent in performance on aluminum insulated metal substrate boards (Al-IMS).

Footprint: 10x11x2.3 mm

TOLT (TO-Leaded Top-side cooling)

TOLT is the TO-Leaded top-side cooling package within the TOLx family. With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20% better RthJA and 50 percent improved RthJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D2PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses.

Footprint: 10x15x2.3 mm

The TOLx package family - Infineon's power MOSFETs in TOLL, TOLG, and TOLT

TOLx package family key features

  • Low RDS(on)
  • High current rating
  • Lower ringing and voltage overshoot compared to D²PAK

TOLx package family key benefits

  • Reduction in conduction losses
  • High power density
  • System efficiency
  • Extended liftime 
  • High efficiency by lower switching losses and lower EMI

TOLx package family target applications

  • Light electric vehicles
  • E-scooter
  • E-bikes
  • Battery management system
  • Hotswap
  • Power and gardening tools
  • Drones
  • Robotics
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: High power density
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: High power density and superior thermal cycling on board (TCoB) performance
  • Key feature: Top-side coooling negative stand-off
  • Key benefit: Excellent thermal performance minmizing thermal ressitance to heatsink

TOLx package family - cooling concept

Comparing TOLL & TOLG

Cooling concept of TO-Leadless and TO-Leaded with gullwing

With TOLL/TOLG board mounting, the heat is dissipated through the PCB to the heatsink. Due to the PCB thermal resistance, power losses occur. TOLL is recommended for FR4 and CU-based IMS boards and TOLG is recommended for Al-IMS boards

Comparing TOLL and TOLT

Cooling concept of TO-Leadless and TO-Leaded top-side cooling

With top-side cooling setup, the drain pad is exposed on the top of the package allowing the majority of the heat to be dissipated into a top-mounted heatsink. 

This pulls heat away from the PCB resulting in at least 20 percent better RthJA compared to standard over-molded TOLL. 

TCoB performance