TO-Leadless is optimized to handle currents of up to 300 A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30 percent compared to D2PAK, together with a height reduction of 50 percent, results in an overall space saving of 60 percent enabling much more compact designs.
TOLG (TO-Leaded with gullwing)
TOLG package offers a compatible footprint to the TO-Leadless package with the additional feature of gullwing leads resulting in 2x higher TCoB performances compared to TO-Leadless. This package is excellent in performance on aluminum insulated metal substrate boards (Al-IMS).
TOLT (TO-Leaded Top-side cooling)
TOLT is the TO-Leaded top-side cooling package within the TOLx family. With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50 percent improved RthJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D2PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses.