PSRAM (Pseudostatic DRAM)
HYPERRAM™ - Low pin count, High bandwidth expansion memories in small footprint

HYPERRAM™ is a stand-alone pSRAM based volatile memory that offers you an easy and inexpensive way to add more RAM to your applications. These low-power devices have high performance and low pin-count, making them ideal for applications requiring external RAM for buffering data, audio, images, video or as a scratchpad for math and data-intensive operations. These devices are available from 64 Mbit up to 512 Mbit in density and support JEDEC compliant HyperBus and Octal xSPI interfaces.
Density : 64Mb, 128Mb, 256Mb, 512Mb
Interface: HyperBus(x8), Octal xSPI(x8) and HyperBus Extended I/O (x16)

HYPERRAM™ 2.0 is the second generation of the HYPERRAM Family of products and support throughputs of upto 400MBps. HYPERRAM™ 2.0 products are available in densities ranging from 64Mb to 512Mb and supports Octal extended SPI interface (Octal xSPI RAM products) in addition to the HyperBus™ interface. HYPERRAM™ 2.0 devices are AEC-Q100 qualified and support Industrial and Automotive temperature grades upto 125°C. The third-generation products - HYPERRAM™ 3.0, doubles the throughput to 800MBps using a new 16-bit extended version of the HyperBus™ interface. 256Mb HYPERRAM™ 3.0 products are now available in production.
Key Features
- Small Form Factor - FBGA package to ensure small PCB footprint
- Low Pin-Count - Low pin-count to aid design simplicity and reduce system cost
- Low Power - Hybrid sleep mode and partial array refresh for energy efficiency
- High Throughput - High read/write bandwidth to maximize system performance

HYPERRAM™ devices are able to achieve high bandwidth compared to traditional parallel expansion memories via the HyperBus Interface. The HyperBus interface utilizes a high-speed 8-bit DDR interface for both address and data along with a differential clock, a read/write latch signal, and a chip select. Both HyperBus and the Octal xSPI interfaces are JEDEC compliant.
HyperBus can also support external NOR flash and RAM on the same bus, and works with any microcontroller with a HyperBus compatible peripheral interface. Visit our HyperBus memories page to know more about HyperFlash memory and HyperRAM + HyperFlash Multi-chip package (MCP) solutions.
To understand how the HyperRAM™ enables a low-pin expansion memory solution, read this whitepaper.
HYPERRAM™ products achieve far higher throughput per pin compared to competing technologies such as traditional pSRAMs and SDR DRAMs which are based on a parallel interface. The in-built self-refresh circuitry and low-power features such as partial array refresh and hybrid sleep enable lower power consumption making HyperRAM apt for power constrained applications such as wearables and IoT devices.
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- Watch the Introduction to HYPERRAM™ 2.0 video
- Get and overview of the product features
- Understand the product applications
- Download the datasheets
- Read the applications notes
- Use the Product Selector to select the appropriate product
- Get your schematics reviewed by the Infineon Applications Engineering Team using Infineon Developer Community
HYPERRAM’s high throughput, low pin-count, smaller footprint and energy efficiency makes it as an ideal expansion memory choice for a variety of automotive, industrial and communication applications.
Automotive Instrument Cluster
- Automotive MCU's have limited internal video RAM
- Require low pin-count, low complexity interface
- Require fast bus speeds for smooth graphics rendering
- Require high-reliability and automotive qualification
For more info regarding Automotive instrument cluster Read here
Industrial Machine Vision camera
- FPGA have limited internal RAM resources
- Require optimized external memory interface IP
- Require low pin-count solution to reduce complexity
For more info regarding Industrial applications Read here
Last Updated: May 06, 2022
Infineon works directly with our partners to ensure our HYPERBUS™ memory solutions are fully compatible with existing and new chipsets. This effort ensures Infineon’s products can be easily paired with chipsets from industry-leading manufacturers while shortening customers’ embedded system design cycles.
Check back regularly to verify the growing list of microcontrollers supporting HYPERBUS™ products.
HYPERBUS™ Chipset Support
Partner | Chipset / Platform Name | Application | HyperFlash | HyperRAM |
Infineon |
TRAVEO™ S6J331x | Automotive Cluster | • | • |
TRAVEO™ S6J335x | Automotive Gateway | • | • | |
TRAVEO™ S6J326Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J324Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J327Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J328Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J32DAx | Automotive Cluster | • | • | |
TRAVEO™ S6J32BAx | Automotive Cluster | • | • | |
TRAVEO™ II CYT4BF | Automotive Body | • | • | |
TRAVEO™ II CYT3BB/4BB | Automotive Body | • | • | |
FM4 Family S6E2DH Series | Industrial | • | • | |
Altera/Intel |
MAX10 | Industrial | • | • |
Cyclone 10 LP | Industrial | • | • | |
Faraday Tech |
A600 | IoT | • | • |
GCT | GDM7243i | IoT | • | • |
Gowin Semiconductor | GW1NSR-2C | FPGA, Industrial | • | • |
Greewaves Technologies | GAP8 | Artificial Intelligence(AI), IoT | • | • |
Lattice Semiconductor | CrossLink-NX | Image Sensor | • | |
Maxim | MAX32650 | Industrial, Portable Medical, IoT | • | • |
Microchip | PolarFire | Industrial, Communications, Defence | • | • |
NXP
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MAC57D5xxx | Automotive Cluster | • | |
S32K148 | Automotive Generic / Body | • | ||
S32V23x | Automotive ADAS | • | ||
Kinetis K80 | Industrial | • | ||
Kinetis K82 | Industrial | • | ||
Kinetis K27F / K28F | Industrial | • | ||
i.MX8 Family | Automotive Infotainment, Industrial, Consumer | • | • | |
i.MX 8ULP | Industrial, Smart Home, HMI |
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i.MX RT1050 |
Industrial |
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i.MX RT1020 |
Industrial |
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i.MX RT1060 |
Industrial |
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i.MX RT1064 |
Industrial |
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MCU-Based Solution for Alexa Voice Service |
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Industrial, Consumer |
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Industrial, Medical |
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Automotive Networking, Industrial |
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I.MX RT family |
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Automotive Radar |
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Consumer, Wearable, IoT |
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Renesas
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Automotive Cluster |
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Automotive Infotainment / ADAS |
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Automotive Digital Cockpit, infotainment |
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Automotive Infotainment / ADAS |
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Automotive Gateway, Domain Control |
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Automotive ADAS |
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Automotive ADAS |
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ADAS / Autonomous Driving |
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Automotive ADAS and A.D. |
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Industrial, A.I. |
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Semidrive |
Automotive Cluster and Body |
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ST
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STM32L4Rx |
Industrial |
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Automotive Gateway |
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SPC58EHx / SPC58NHx |
Automotive Body, Network, Security |
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Industrial |
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Industrial |
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Texas Instruments |
Industrial |
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Industrial, Networking |
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Automotive Digital Cockpit |
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ADAS |
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Xilinx
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Communications |
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Communications |
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Communications |
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Communications / Industrial |
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Networking |
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Networking |
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Various |
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Industrial |
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Industrial |
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HYPERBUS™ 3rd Party Development Platform
Partner | 3rd Party Development Platform |
Application | HyperFlash | HyperRAM |
Trenz Electronics |
TE0725 with Xilinx Artix-7 | Industrial | • | • |
TE0748 with Xilinx Artix | Secure SD | • | • | |
Devboards | HyperMAX with Altera MAX10 | Industrial, Medical, Automotive |
HyperBus Memory Controller IP
IP Supplier |
Link |
Can be integrated in FPGA as Soft IP |
Can be integrated in a SoC |
Infineon |
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Cadence |
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Mobiveil |
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Synaptic Laboratories Ltd. |
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Synopsys |
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HyperBus Memory Controller Verification IP
IP Supplier | Link | HyperFlash | HyperRAM |
Cadence | Link for Cadence | • | • |

- Understand the evolution of the cockpit architecture
- Recognize the importance of the central modules like head unit and cockpit domain controllers and get to know Infineon solutions and their components

In this training you will:
- Understand the need for an expansion memory
- Recognize the key attributes designers look for in an expansion memory
- Describe the challenges with existing expansion memory options