Infineon Introduces DECT 6.0 / CAT-iq Chipset with Texas Instruments’ Puma 5 DOCSIS 3.0 Cable Modem Solution

Neubiberg, Germany and New Orleans, USA – May 19, 2008 – Infineon Technologies AG (FSE/NYSE: IFX) announced, today at the 2008 Cable TV Show, a cost-effective DECT solution, which when combined with a DOCSIS® 3.0 chipset, produces a platform for North American cable service providers to deploy next-generation Voice-over-IP (VoIP) services operating over DECT 6.0 cordless telephones. The resulting platform, which combines Infineon’s COSIC™ modem and DUSLIC™-xT with Texas Instruments’ (NYSE: TXN) PUMA 5 chipset, enables system integrators to develop eMTA (Embedded Terminal Media Adapter) products that conform to the latest standards in DOCSIS 3.0 (Data Over Cable Service Interface Specification), and the latest DECT 6.0 / CAT-iq™ cordless telephony standards.

The new platform unlocks additional revenue potential for cable service providers by offering the benefits of a user-installable VoIP solution, which require no home phone wiring or truck rolls, with extended features that enable the provision of additional revenue-generating services to the end user. The consumer will benefit from interference-free cordless phones that offer wideband audio (“HD” sound) and support for multiple concurrent calls to separate external parties, along with new Internet-like applications on the handset, such as access to online address books, buddy lists, and stock and weather tickers. The eMTA with integrated DECT 6.0 is also capable of continued service during power failure since the base station is powered by the eMTA’s standby battery, and the handsets feature more than 170 hours of standby and over 15 of talk-time.

"Infineon's COSIC-Modem chipset offers a low-cost, full feature add-on to our Puma 5 DOCSIS 3.0 cable modem chipset, which allows applications and platforms to leverage the flexible architecture of the industry’s first DOCSIS 3.0 compliant solution and draws on TI’s extensive Voice over Cable experience to meet diverse VoIP market needs," said Ran Senderovitz, Cable Business Manager of Texas Instruments. "The DECT enabled eMTA platform, with features based on TI's Puma 5 chipset, offers cable manufacturers and Multiple System Operators (MSO) the ability to deliver a completely new telephony experience to the consumer."

“By combining Texas Instruments’ cable modem with Infineon’s field-proven DECT and SLIC™ products, we can now offer a unified platform that supports both next-generation DECT cordless telephones, as well as legacy analog phones,” said Imran Hajimusa, Vice President of Broadband Access Products of the Communication Solutions business group, Infineon Technologies North America. “This modular solution enables OEM customers to develop a family of products that meet the requirements of the world-wide customer base.”

The DECT-enabled eMTA platform includes Texas Instruments’ PUMA 5 DOCSIS 3.0-based cable modem chipsets, optimized for triple play and next-generation IP services; Infineon’s COSIC family optimized for DECT 6.0 / CAT-iq base station, handset and VoIP gateways; and Infineon’s DUSLIC-xT (Dual-channel Subscriber Line Interface Circuit) device for voice and VoIP-enabled device.

About Infineon’s COSIC Family

Infineon’s COSIC is a monolithic cordless IC that enables the most optimized DECT 6.0 / CAT-iq Handset and Base Station / VoIP Gateway solution for the residential environment. The flexible and scalable feature-set supports all relevant standards including DECT, DECT 6.0 and CAT-iq. The COSIC devices include a baseband controller, RF transceiver and power amplifier on the same chip with the lowest system bill-of-material cost, best optimized manufacturing and logistics, simplified development and design, and best-in-class system performance.

For more information about Infineon’s DECT and DuSLIC-xT products, please visit: www.infineon.com/dect and www.infineon.com/duslic-xt

Availability

This DECT-enabled eMTA solution will be available the second half of 2008.

For more information about TI’s Puma family of DOCSIS 3.0 products, please visit: www.ti.com/corp/docs/landing/puma5

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).