Complaint Analysis Request Form Customer information Customer reference case number Date Customer name* Purchaser of material (if different from cust.): Customer adress Street: Postal Code: City: Country: End Customer Contact Person at Customer Name Email* Phone Fax* Provided samples (in testable condition acc. to JESD 671B) Quantity of returned devices for analysis: Please use solit and ESD protected packaging material for shipment. Please proide an adequate number of fail devices. Quantity of returned pass reference devices: Reference devices are strongly supporting the analysis at Infineon, since fail and pass behavior can be compared. Have the provided samples been used in a safety critical application? yes no Are all returned devices free from hazardous material or harmful contamination? yes no If no please specify: Object (please enter at least enough data for a clear identification) Product Name: Customer Part Number: Delivery Note Number: Lot Number(s) / ID(s): MA# (IFX internal) Sold to No. (IFX internal) Date code: Part marking/Barcode: Defecet / Failure Description Kind of failure: Electrical Mechanical Logistical Other With which method were you able to detect the error? Test setup, ambient conditions (e. g. Temperature / Voltage). Infineon will use this information to verify the defect. Method: The failure is reproducible stable intermittent Product conditon Originally packed Not originally packed Failure description (Please describe the circumstances of the failure as deteailed as possible) Where on the Objects is the defect located? Please describe where on the object the defect (mechanical/functional) can be deceted. In case, please add pictures/screen shots. At which site the defect has been noticed first (geographical, e.g. production site)? The defect is related to: Qualification Incoming Inspection Production 0km/putting into operation Field - in use since Was the devic exposed to a certain stress-test? no yes If yes - please describe the stress test treatment (e.g. Jedec standard, cycling of power/temperature/startup) Where on the Objects is the defect located? Please describe where on the object the defect (mechanical/functional) can be deceted. In case, please add pictures/screen shots. Defect location on object (e.g. top/bottom, pin/wire, frame/die): Defect location in system (e.g. name of failed device on board): Any other abnormality on the same board or in the same system? no yes Does the failure disappear if device is replaced with a new one? no yes (failure disappears in system) When in time has the defect been first observerd? Date / time (date or time interval) What is the time pattern, when does the defect show up? Only once Sporadically Suddenly since (point in time) Periodically Continuously Other Where in the process was the defect observed? The device showed the failure when performing: Which regular process steps have been performed pass before the device failed? How many objects / which failure rates with this defect have been found? Number of defective parts: Total verified quantity: Failure rate [%] Unit (pcs/wafer/reel/other): Unit (pcs/wafer/reel/other): Send Cancel All fields marked with an asterisk (*) are mandatory.