IPDD60R190G7
Überblick
Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Zusammenfassung der Merkmale
- Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
- Innovative top-side cooling concept
- Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
- TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Vorteile
- Enabling highest energy efficiency
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
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