FF1200XTR17T2P5 1700 V, 1200 A dual IGBT module

Überblick

XHP™ 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology and TRENCHSTOP™ IGBT5 for high reliability and robustness, combined with system availability and long lifetime for high power traction and wind applications.

Also available with preapplied Thermal Interface Material (TIM).

Zusammenfassung der Merkmale

  • Extended operation temperature (Tvjop= 175°C)
  • Output current increased by more than 25% in the same footprint
  • Copper bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 600

Vorteile

  • Easier paralleling of modules
  • Increase in Power Density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions
Support