Accelerate your eID project realization with ready-to-go SECORA™ ID solution
Hardware, packages, antenna inlays, OS, applets and support from Infineon
The increasing demand for multi-application and local, country-specific requirements for electronic identity documents require a flexible, fast and secured solution. SECORA™ ID is our new ready-to-go Java Card™ solution optimized for all electronic identification (eID) applications. It enables security printers and card manufacturers to accelerate their time-to-market through ready-to-use applets supporting rapid project migration. SECORA™ ID offering:
SECORA™ ID solution including applets – ready-to-use
SECORA™ ID platform plus development tool for applet development (maximum customization)
Ready-to-use, flexible design
One-stop shop offering ready-to-use solutions
Highest possible levels of customization
Best-in-class cardholder experience
Rapid project migration
Dynamic Java Card™ platform for electronic document use cases
Off-the-shelf CC-certified chip plus CC-certified Java Card™ OS with CC-certified applets for eID as certification target
One supplier for chip, software and extensive packaging option
Applet development tools based on Eclipse
Faster personalization performance based on Infineon’s SOLID FLASH™
Faster project execution and time-to-market
Reduced supplier complexity
Optimization of stock management
Contactless robustness and performance
Reduction of total cost of ownership
Ready to use
A ready-to-go Java Card™ solution optimized for all electronic identification (eID) applications. Accelerating time-to-market through ready-to-use applets supporting rapid project migration.
Combined with our Java Card development tool, the SECORA™ ID platform gives maximum freedom to develop and implement customized applets according to proprietary or local requirements.
Sophisticated SLC52G platform
The SLC52G is a real 16-bit platform with Integrity Guard (Infineon's double CPU security technology), SOLID FLASH™ and VHBR with up to 6.8 Mbit/sec. SLC52G is CC EAL 6+ high certified according to Common Criteria.
Comprehensive packaging offering
The most innovative package technology Coil on Module is based on flip chip technology, which allows easy integration of contactless and dual interface inlays in cards and electronic passports.
SECORA™ ID portfolio comprises the S and X variants
SECORA™ ID S is designed for use cases like e.g. electronic ID cards, electronic passports, digital signatures, electronic driving licenses and health cards.
SECORA™ ID X, the high-performance version for ID applications is optimized for use cases with multi-application, as well as for the support of LDS 2.0